MT29F256G08CJAAAWP-ITZ:A

IC FLASH 256GBIT PAR 48TSOP I
Part Description

IC FLASH 256GBIT PAR 48TSOP I

Quantity 1,391 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48-TSOP IMemory FormatFLASHTechnologyFLASH - NAND (MLC)
Memory Size256 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging48-TFSOP (0.724", 18.40mm Width)
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F256G08CJAAAWP-ITZ:A – 256Gbit Parallel NAND Flash, 48‑TSOP I

The MT29F256G08CJAAAWP-ITZ:A is a 256 Gbit non-volatile NAND flash memory device using MLC (multi-level cell) technology and organized as 32G × 8. It provides high-density parallel flash storage in a 48‑TSOP I (48‑TFSOP, 0.724", 18.40 mm width) package.

Designed for systems that require parallel-interface NAND storage, this device supports a 2.7 V to 3.6 V supply range and an operating temperature range from −40 °C to 85 °C, enabling use where wide voltage tolerance and extended temperature operation are required.

Key Features

  • Memory Type Non-volatile NAND flash based on MLC technology for dense data storage.
  • Capacity & Organization 256 Gbit total capacity, organized as 32G × 8 to simplify bus interfacing and memory mapping.
  • Interface Parallel memory interface for compatibility with systems designed for parallel flash devices.
  • Voltage Supply Operates from 2.7 V to 3.6 V to support common single-supply system designs.
  • Package 48‑TSOP I (48‑TFSOP, 0.724" / 18.40 mm width) supplier device package for board-level mounting and integration.
  • Temperature Range Specified operating temperature from −40 °C to 85 °C (TA) for applications requiring extended ambient tolerance.

Typical Applications

  • Embedded storage Non-volatile program and data storage where a parallel NAND interface and high capacity are required.
  • Firmware and image storage Storage of firmware, boot images or large data sets in systems that use parallel flash memory.
  • Systems operating across wide temperatures Designs that require reliable operation between −40 °C and 85 °C.

Unique Advantages

  • High density in a compact package: 256 Gbit capacity delivered in a 48‑TSOP I package helps maximize storage per board area.
  • Parallel interface compatibility: Parallel memory interface supports legacy and existing parallel-flash system architectures without serial redesign.
  • Wide supply range: 2.7 V to 3.6 V operation offers flexibility for systems with varying power rails.
  • Extended ambient operation: Rated for −40 °C to 85 °C to support deployments in thermally challenging environments.
  • Clear memory organization: 32G × 8 organization simplifies addressing and integration into existing memory maps.

Why Choose IC FLASH 256GBIT PAR 48TSOP I?

The MT29F256G08CJAAAWP-ITZ:A provides a straightforward, high-capacity NAND flash solution for designs that require parallel-interface non-volatile storage with a defined operating voltage range and extended temperature capability. Its 32G × 8 organization and 48‑TSOP I package make it suitable for integration into systems where board footprint, bus compatibility, and data density are key considerations.

This device is appropriate for engineers and procurement teams specifying high-density parallel NAND flash for applications needing reliable operation from −40 °C to 85 °C and a 2.7 V–3.6 V power envelope, offering a clear specification set for system-level integration and long-term deployment.

Request a quote or contact sales to discuss availability, lead times, and pricing for the MT29F256G08CJAAAWP-ITZ:A.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up