MT29F256G08CJABAWP-IT:B

The MT29F256G08CJABAWP-IT:B is a 256 Gbit non-volatile NAND flash memory device implemented with MLC technology and a parallel memory interface. It provides high-density, parallel-access flash storage in a 48-TSOP I package intended for designs that require large-capacity non-volatile memory.

Designed for systems operating across a wide voltage range and industrial temperature window, this device targets applications that require robust, high-capacity flash memory with a parallel interface and standard TSOP footprint.

Key Features

• Memory Technology Multi-Level Cell (MLC) NAND flash technology providing non-volatile storage.
• Memory Capacity & Organization 256 Gbit total capacity organized as 32G × 8, enabling byte-wide parallel data access.
• Interface Parallel memory interface for direct parallel data transfers with host controllers.
• Supply Voltage Operates from 2.7 V to 3.6 V, supporting common 3.3 V system rails.
• Operating Temperature Specified for −40°C to 85°C ambient (TA), suitable for designs requiring an extended temperature range.
• Package 48-TFSOP / 48-TSOP I package (0.724" / 18.40 mm width) for board-level integration with a compact TSOP footprint.

Typical Applications

• Embedded storage systems — Provides high-density non-volatile storage for systems that require 256 Gbit of parallel NAND flash.
• Firmware and code storage — Suitable for storing large firmware images or code in designs that use a parallel flash interface.
• Industrial equipment — The −40°C to 85°C operating range and 3.6 V maximum supply make it applicable to industrial-temperature designs needing high-capacity flash.
• Board-level replacements — 48-TSOP I package and standard TSOP width enable integration into existing TSOP-based board layouts.

Unique Advantages

• High density in a compact package: 256 Gbit capacity in a 48-TSOP I footprint supports large storage requirements without a larger package.
• Parallel byte-wide organization: 32G × 8 memory organization enables direct parallel data access for systems designed around an 8-bit parallel interface.
• Wide voltage compatibility: 2.7 V to 3.6 V supply range aligns with common 3.3 V system rails, simplifying power-supply integration.
• Extended operating temperature: Rated for −40°C to 85°C ambient, accommodating designs that must tolerate a broad temperature range.
• Standard TSOP form factor: 48-TFSOP / 48-TSOP I package supports straightforward board placement in TSOP-based designs.

Why Choose IC FLASH 256GBIT PAR 48TSOP I?

The MT29F256G08CJABAWP-IT:B positions itself as a high-density parallel NAND flash option for designs that need 256 Gbit of non-volatile storage in a TSOP footprint. Its MLC NAND architecture, byte-wide organization, and parallel interface make it suited to systems that require direct parallel access to large flash memory arrays.

This device is appropriate for engineers and procurement teams building products that demand large-capacity flash, standard TSOP packaging, and operation across a broad supply and temperature range. It delivers a compact, high-capacity storage element that aligns with designs constrained by board space and TSOP layouts.

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