MT29F256G08CJAABWP-12Z:A
| Part Description |
IC FLASH 256GBIT PAR 48TSOP I |
|---|---|
| Quantity | 572 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 48-TSOP I | Memory Format | FLASH | Technology | FLASH - NAND (MLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 83 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 48-TFSOP (0.724", 18.40mm Width) | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F256G08CJAABWP-12Z:A – 256 Gbit Parallel NAND Flash (48‑TSOP I)
The MT29F256G08CJAABWP-12Z:A is a 256 Gbit non-volatile flash memory device based on NAND MLC technology. It is organized as 32G × 8 and provides parallel flash storage in a 48‑TSOP I package.
Designed for systems that require parallel NAND flash storage, this device combines high density, a defined clock interface, and a standard TSOP form factor to support board-level integration in commercial temperature environments.
Key Features
- Memory Architecture 256 Gbit capacity organized as 32G × 8, implemented with NAND MLC flash memory.
- Interface & Clock Parallel memory interface with a specified clock frequency of 83 MHz for synchronous operation with parallel host controllers.
- Voltage Supply Operates across a 2.7 V to 3.6 V supply range, suitable for 3 V systems.
- Package & Mounting Supplied in a 48‑TSOP I package (48‑TFSOP, 0.724" / 18.40 mm width) for board-level mounting and PCB footprint compatibility.
- Memory Format FLASH (NAND) non-volatile memory format.
- Operating Temperature Commercial ambient operating range of 0 °C to 70 °C.
Typical Applications
- Embedded Storage Parallel NAND flash capacity for embedded systems requiring on-board non-volatile memory up to 256 Gbit.
- Firmware and Data Storage Use in designs that require solid-state storage in a parallel interface format and a standard TSOP package.
- Legacy Parallel Interface Designs For systems that integrate parallel memory devices and rely on an 83 MHz clock specification.
Unique Advantages
- High-density non-volatile capacity: 256 Gbit (32G × 8) enables substantial on-board storage without external modules.
- Parallel interface fit: Parallel memory interface and defined 83 MHz clock make the device suitable for designs using parallel NAND interfaces.
- Wide supply tolerance: 2.7 V to 3.6 V operation supports common 3 V system rails.
- Standard TSOP I packaging: 48‑TSOP I (48‑TFSOP) package simplifies PCB integration in board-level applications.
- Commercial temperature rating: 0 °C to 70 °C operation for standard commercial deployments.
Why Choose MT29F256G08CJAABWP-12Z:A?
Manufactured by Micron Technology Inc., the MT29F256G08CJAABWP-12Z:A provides a combination of high-density MLC NAND flash, a parallel interface with an 83 MHz clock specification, and a standard 48‑TSOP I package. These characteristics make it suitable for designers seeking a straightforward, board-mounted parallel flash solution within a commercial temperature range.
The device is well suited to projects that require sizable non-volatile storage while maintaining compatibility with parallel memory architectures and 3 V supply environments, offering a clear path for integration into existing parallel-memory designs.
Request a quote or submit an inquiry for MT29F256G08CJAABWP-12Z:A to confirm availability and pricing for your design requirements.
