MT29F32G08ABEABM73A3WC1L

The MT29F32G08ABEABM73A3WC1L is a 32 Gbit non-volatile NAND flash memory delivered as a die and implemented using single-level cell (SLC) NAND technology. The device is organized as 4G × 8 and supports both asynchronous and synchronous I/O modes with ONFI 2.2 compliance.

This die-form NAND flash targets designs requiring SLC reliability and performance in a raw die format. Key value propositions include SLC endurance, multi-mode I/O performance, and an advanced command set for flexible block and plane management.

Key Features

• Memory Type & Capacity  32 Gbit SLC NAND flash organized as 4G × 8 (device size 32Gb: 4096 blocks as specified in the product family).
• Page, Block and Plane Organization  Page size (x8): 8,640 bytes (8,192 + 448). Block size: 128 pages (1,024K + 56K bytes). Two planes with 2,048 blocks per plane.
• Synchronous and Asynchronous I/O  Supports synchronous I/O up to timing mode 5 with DDR clocking and asynchronous I/O up to timing mode 5; synchronous read/write throughput per pin up to 200 MT/s, asynchronous up to 50 MT/s.
• Performance Timings  Array performance examples: read page up to 35 µs (max), program page ~350 µs (typ), erase block ~1.5 ms (typ); RC/ WC minimum 20 ns (as specified for ONFI modes).
• Operating Voltage  VCC: 2.7–3.6 V. VCCQ: 1.7–1.95 V or 2.7–3.6 V (supported voltage ranges provided in device documentation).
• Advanced Command Set  ONFI NAND Flash Protocol with advanced commands including program cache, read cache (sequential and random), one-time programmable (OTP) mode, multi-plane commands, multi-LUN operations, read unique ID, copyback, and more.
• Reliability  Endurance rated at 80,000 program/erase cycles and JEDEC JESD47G-compliant data retention; operation status byte reports completion and pass/fail conditions.
• Package & Temperature  Supplied as a die. Commercial operating temperature: 0°C to +70°C.

Typical Applications

• Embedded system storage  Die-level SLC NAND for designs that integrate non-volatile code and data storage directly into custom packages or multi-die modules.
• Module and subsystem integration  For module manufacturers and system integrators requiring raw die NAND to incorporate into controllers, custom packages or proprietary storage assemblies.
• High-reliability data storage  Use where SLC endurance and advanced command features (multi-plane, copyback, OTP) are required for extended program/erase lifetimes and data management.

Unique Advantages

• SLC endurance (80,000 P/E cycles)  Supports extended program/erase cycling for applications that require long-term write durability compared to multi-level cell options.
• Dual I/O modes with high throughput  Synchronous DDR operation up to 200 MT/s per pin plus asynchronous modes provides design flexibility for performance-tuned interfaces.
• ONFI 2.2 compliance  Standardized command set and timing modes simplify integration with ONFI-compatible controllers and firmware.
• Advanced command and management features  Built-in program/read caches, multi-plane and multi-LUN operations, OTP and copyback enable efficient data handling and reduced host overhead.
• Die-level supply for custom integration  Die format allows direct incorporation into custom packages, stacked assemblies, or bespoke module designs where board-level footprint or form factor constraints apply.
• Documented operating voltages and timings  Clear VCC/VCCQ ranges and timing mode support enable predictable power design and timing closure during system integration.

Why Choose MT29F32G08ABEABM73A3WC1L?

The MT29F32G08ABEABM73A3WC1L combines SLC NAND endurance with flexible I/O modes and an extensive command set, making it suitable for designers who need die-level non-volatile storage with predictable endurance and performance characteristics. Its ONFI 2.2 compliance and documented timing/voltage ranges simplify controller integration and system validation.

This die is a practical choice for module manufacturers, system integrators, and OEMs that require raw NAND for custom packaging or specialized storage subsystems, offering long-term program/erase durability and on-die features that reduce host-side management complexity.

Request a quote or submit a product inquiry to receive pricing, availability, and integration support for this die-level NAND flash.