MT29F32G08AECBBH1-12:B TR

IC FLASH 32GBIT PARALLEL 100VBGA
Part Description

IC FLASH 32GBIT PARALLEL 100VBGA

Quantity 66 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-VBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size32 GbitAccess TimeN/AGradeCommercial
Clock Frequency83 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging100-VBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization4G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F32G08AECBBH1-12:B TR – IC FLASH 32GBIT PARALLEL 100VBGA

The MT29F32G08AECBBH1-12:B TR is a 32 Gbit non-volatile NAND flash memory device in a 100-ball VBGA (12×18) package. It implements NAND FLASH technology with a parallel interface and is intended for high-density embedded storage applications requiring SLC-based flash architecture.

Designed for applications that need compact, high-capacity NAND in a solder-down BGA footprint, the device provides a range of synchronous and asynchronous I/O modes along with Micron’s NAND command set and advanced data management features.

Key Features

  • Memory Core — 32 Gbit NAND flash organized as 4G × 8, with 4096 blocks per device (32Gb density).
  • Cell Technology — Single-level cell (SLC) NAND technology as specified in the device datasheet.
  • Organization and Geometry — Page size (×8): 8640 bytes (8192 + 448); block size: 128 pages; plane structure: 2 planes × 2048 blocks per plane.
  • Interface and Timing — Parallel NAND interface with support for asynchronous and synchronous I/O; ONFI 2.2-compliant operation per the datasheet. Clock frequency specified as 83 MHz in device data.
  • Performance Characteristics — Synchronous throughput up to 200 MT/s per pin (DDR timing modes); asynchronous throughput up to 50 MT/s per pin; typical array timings include read page (35 µs), program page (350 µs), and erase block (1.5 ms) as listed in the datasheet.
  • Voltage and Power — Operating supply range VCC: 2.7–3.6 V; VCCQ options noted in the datasheet (1.7–1.95 V or 2.7–3.6 V depending on configuration).
  • Package — 100-ball VBGA package (12×18 mm ball grid array) for compact board-level integration.
  • Operating Temperature — Commercial temperature range: 0°C to +70°C (TA).
  • Advanced Command Set — Supports program cache, read cache (sequential and random), multi-plane commands, multi-LUN operations, copyback, OTP mode, read unique ID, and standard ONFI commands; RESET (FFh) required as first command after power-on.
  • Reliability — Endurance rated at 80,000 program/erase cycles and data retention compliant with JESD47G per the datasheet.

Typical Applications

  • Embedded Storage — High-density, soldered NAND for firmware, file systems, and local data storage in embedded platforms.
  • Consumer and Connected Devices — On-board non-volatile storage for set-top boxes, media devices, and consumer electronics requiring compact 32 Gbit memory.
  • Networking and Infrastructure — Boot and data storage in network appliances and communications equipment where compact BGA packaging and SLC endurance are required.

Unique Advantages

  • High Density in a Small Footprint: 32 Gbit capacity in a 100-ball VBGA (12×18) package reduces board area compared to discrete solutions.
  • Flexible Interface Modes: Support for both asynchronous and synchronous (ONFI 2.2) I/O enables designers to select the timing mode that matches system performance and design constraints.
  • SLC Endurance: Single-level cell technology with an endurance specification of 80,000 program/erase cycles provides longevity for write-intensive applications.
  • Advanced Command and Cache Support: Program cache, read cache, multi-plane and copyback operations improve effective throughput and internal data management.
  • Wide Operating Voltage Range: 2.7–3.6 V supply range supports common system power rails for easy integration.
  • Deterministic Array Timing: Published typical and maximum timings (read, program, erase) aid system-level timing and performance planning.

Why Choose IC FLASH 32GBIT PARALLEL 100VBGA?

The MT29F32G08AECBBH1-12:B TR is positioned as a compact, high-density NAND flash device that combines SLC reliability with a parallel interface and advanced NAND command features. Its package, voltage range, and documented array timings make it suitable for embedded and infrastructure designs that require on-board, soldered non-volatile storage.

Engineers specifying this device benefit from Micron’s documented endurance and data retention metrics, a comprehensive command set for performance tuning, and a package optimized for space-constrained board designs.

Request a quote or submit a pricing and availability inquiry to evaluate MT29F32G08AECBBH1-12:B TR for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up