MT29F32G08AECCBH1-10:C

IC FLASH 32GBIT PARALLEL 100VBGA
Part Description

IC FLASH 32GBIT PARALLEL 100VBGA

Quantity 935 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-VBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size32 GbitAccess TimeN/AGradeCommercial
Clock Frequency100 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging100-VBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization4G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F32G08AECCBH1-10:C – IC FLASH 32GBIT PARALLEL 100VBGA

The MT29F32G08AECCBH1-10:C is a 32 Gbit non-volatile NAND flash memory device in a 100-ball VBGA (12×18) package. It implements single-level cell (SLC) NAND architecture with a 4G × 8 memory organization and a parallel memory interface optimized for commercial embedded storage applications.

Designed for systems requiring moderate capacity, durable program/erase endurance, and flexible I/O timing, this device offers both asynchronous and synchronous operation modes, a wide operating voltage range, and a commercial operating temperature rating for mainstream consumer and industrial-grade designs.

Key Features

  • Memory Type & Architecture Single-level cell (SLC) NAND flash with a 4G × 8 organization providing 32 Gbit of non-volatile storage.
  • Capacity & Geometry 32 Gbit device size with 4,096 blocks (device-specific block count) and a page size of 8,192 bytes user data plus 448 bytes spare per page as documented in the family datasheet.
  • Interface & Standards Parallel memory interface supporting ONFI 2.2-compliant operation for standardized command and timing behavior in both asynchronous and synchronous modes.
  • Performance Modes Synchronous I/O (up to synchronous timing mode 5) and asynchronous I/O (up to mode 5). Synchronous throughput up to 200 MT/s per pin; asynchronous throughput up to 50 MT/s per pin (datasheet values).
  • Timing & Data Rates Device supports clocked operation (example clock reference 100 MHz) and data strobe (DQS) signals for synchronous data alignment.
  • Program/Erase/Read Latencies Typical array performance figures from the family datasheet include read page ~35 μs (max), program page ~350 μs (typical), and erase block ~1.5 ms (typical).
  • Endurance & Data Retention Endurance specified at 80,000 program/erase cycles (family datasheet) with data retention and qualification references per JESD47G in the documentation.
  • Supply Voltage Options VCC operating range 2.7–3.6 V; VCCQ support options include 1.7–1.95 V or 2.7–3.6 V, enabling flexible I/O voltage configurations.
  • Package & Temperature 100-ball VBGA (12×18) package and commercial operating temperature 0°C to +70°C (TA) as specified for this part number.
  • Advanced Command Set Supports ONFI command set features such as program cache, read cache (sequential and random), multi-plane and multi-LUN operations, OTP mode, read unique ID, and copyback operations (per datasheet).
  • Factory State & ECC First block (block address 00h) is valid when shipped from factory; minimum required ECC guidance is provided in the device error management documentation.

Typical Applications

  • Embedded Storage (Consumer Devices) Provides non-volatile mass storage for firmware, applications, and user data in consumer electronics that require a 32 Gbit SLC NAND device.
  • Commercial Embedded Systems Suited for commercial-grade embedded controllers and appliances that need reliable program/erase endurance and parallel NAND connectivity.
  • Boot and Firmware Storage Used for boot code and firmware images where robust erase/program cycles and defined first-block factory state are important for system bring-up.

Unique Advantages

  • Proven SLC NAND Architecture: Single-level cell technology provides higher endurance characteristics (80,000 P/E cycles) compared with multi-level options, supporting longer device life for write-intensive workloads.
  • Flexible I/O Timing: Support for both asynchronous and synchronous modes (ONFI 2.2) and data strobe (DQS) enables designers to balance throughput and system timing requirements.
  • Wide Voltage Support: VCC 2.7–3.6 V and VCCQ options allow integration into systems with different I/O voltage domains without changing device family.
  • Compact BGA Package: 100-ball VBGA (12×18) package provides a small footprint for space-constrained PCBs while delivering a full 32 Gbit capacity.
  • Documented Operational Metrics: Datasheet-provided read, program, and erase timing figures allow predictable performance budgeting in system designs.

Why Choose IC FLASH 32GBIT PARALLEL 100VBGA?

The MT29F32G08AECCBH1-10:C is positioned for designs that require a 32 Gbit SLC NAND solution with parallel interface flexibility, clear performance metrics, and strong endurance characteristics. Its ONFI-compliant command set and synchronous/asynchronous operation modes make it suitable for systems that must balance throughput, timing, and integration constraints.

This part is appropriate for engineers specifying commercial-grade embedded storage where predictable read/program/erase behavior, compact 100-ball VBGA packaging, and documented electrical/timing parameters are required. The device’s endurance and documented error management guidance support longer-term reliability planning in product lifecycles.

If you would like pricing, availability, or to request a formal quote for MT29F32G08AECCBH1-10:C, submit a quote request or contact our sales channel for further assistance.

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