MT29F32G08CBADAWP:D TR

IC FLASH 32GBIT PAR 48TSOP I
Part Description

IC FLASH 32GBIT PAR 48TSOP I

Quantity 231 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48-TSOP IMemory FormatFLASHTechnologyFLASH - NAND
Memory Size32 GbitAccess TimeN/AGradeCommercial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging48-TFSOP (0.724", 18.40mm Width)
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization4G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F32G08CBADAWP:D TR – IC FLASH 32GBIT PAR 48TSOP I

The MT29F32G08CBADAWP:D TR is a 32 Gbit non-volatile NAND flash memory device with a parallel interface, supplied in a 48-TSOP I package. It provides high-density FLASH storage with a 4G × 8 memory organization and operates from a 2.7 V to 3.6 V supply.

Supplied in a compact 48-TFSOP (0.724", 18.40 mm width) package and rated for 0°C to 70°C ambient operation, this part is targeted at systems requiring parallel NAND FLASH memory in a standard TSOP I footprint.

Key Features

  • Memory Type & Technology Non-volatile FLASH memory using NAND technology for persistent data storage.
  • Capacity & Organization 32 Gbit total capacity arranged as 4G × 8, providing high-density storage in a single device.
  • Memory Interface Parallel memory interface for systems that require parallel FLASH access.
  • Voltage Supply Operates from 2.7 V to 3.6 V, compatible with common 3 V system rails.
  • Package 48-TSOP I / 48-TFSOP (0.724", 18.40 mm width) supplier device package for board-level mounting.
  • Operating Temperature Commercial ambient rating of 0°C to 70°C (TA).
  • Memory Format FLASH memory format suitable for non-volatile storage applications.

Unique Advantages

  • High-density non-volatile storage: 32 Gbit capacity in a single device reduces part count for large storage requirements.
  • Parallel interface support: Parallel memory interface simplifies integration into systems that use parallel NAND FLASH.
  • Wide supply voltage range: 2.7 V–3.6 V operation fits common 3 V system designs.
  • Compact TSOP I package: 48-TSOP I (0.724", 18.40 mm) package enables designs that require this standard footprint.
  • Commercial temperature suitability: Rated for 0°C–70°C ambient operation for typical commercial applications.

Why Choose IC FLASH 32GBIT PAR 48TSOP I?

The MT29F32G08CBADAWP:D TR combines a 32 Gbit NAND FLASH capacity with a parallel interface and a standard 48-TSOP I package, providing a straightforward option for designs that need large non-volatile storage in a TSOP footprint. Its 4G × 8 organization, 2.7 V–3.6 V supply range, and commercial temperature rating make it appropriate for systems built around parallel FLASH memory.

This device is suitable for engineers and procurement teams specifying a high-density parallel FLASH component where package, voltage range, and operating temperature are key selection criteria.

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