MT29F32G08CBADAWP-M:D

The MT29F32G08CBADAWP-M:D is a 32 Gbit NAND flash memory device provided by Micron Technology Inc. It is organized as 4G x 8 and implements parallel FLASH memory architecture for non-volatile storage.

Packaged in a 48-TSOP I (48-TFSOP, 0.724" / 18.40mm width), the device supports a 2.7 V to 3.6 V supply range and is specified for operation from 0°C to 70°C, making it suitable for board-level integration where parallel FLASH capacity and standard TSOP packaging are required.

Key Features

• Memory Type Non-volatile FLASH NAND memory providing persistent data storage without power.
• Capacity & Organization 32 Gbit capacity organized as 4G × 8, delivering large on-board storage density in a single device.
• Interface Parallel memory interface for integration with parallel bus architectures and legacy parallel controllers.
• Power Operates from a 2.7 V to 3.6 V supply range to match common 3.3 V system rails.
• Package Available in a 48-TSOP I package (48-TFSOP, 0.724" / 18.40 mm width) for compact board-level placement.
• Operating Temperature Rated for 0°C to 70°C (TA), suitable for standard commercial temperature environments.
• Manufacturer Supplied by Micron Technology Inc., a recognized supplier of memory components.

Typical Applications

• Embedded system storage — Provides non-volatile program and data storage for systems that use parallel FLASH memory.
• Firmware and boot code storage — Holds system firmware and boot images where parallel FLASH organization is required.
• Data logging and local retention — Stores logged data or configuration parameters on-board in a non-volatile format.
• Board-level integration — Fits designs that require a 48-TSOP I package and a 2.7 V–3.6 V supply domain.

Unique Advantages

• Large single-device capacity: 32 Gbit density reduces the number of parts needed for high-capacity non-volatile storage.
• Parallel interface compatibility: Parallel memory interface supports integration with parallel bus controllers and existing parallel architectures.
• Standard TSOP package: 48-TSOP I (48-TFSOP) package enables compact footprint and straightforward board placement.
• Flexible supply range: 2.7 V to 3.6 V operation aligns with common 3.3 V system rails for simplified power design.
• Commercial temperature rating: Specified for 0°C to 70°C operation for typical commercial applications.
• Defined memory organization: 4G × 8 arrangement facilitates addressing and system partitioning for firmware and data.

Why Choose MT29F32G08CBADAWP-M:D?

The MT29F32G08CBADAWP-M:D positions itself as a high-density parallel NAND FLASH option for designs that require 32 Gbit of non-volatile storage in a compact 48-TSOP I package. Its 4G × 8 organization, parallel interface, and 2.7 V–3.6 V supply make it suitable for systems that need large on-board storage while maintaining compatibility with common voltage rails.

This device is appropriate for engineers specifying board-level FLASH for firmware, boot code, or data retention in commercial-temperature applications. Sourced from Micron Technology Inc., it provides a clearly defined package and electrical envelope for integration into established parallel-memory designs.

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