MT29F512G08CFCBBWP-10:B
| Part Description |
IC FLASH 512GBIT PAR 48TSOP I |
|---|---|
| Quantity | 467 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 48-TSOP I | Memory Format | FLASH | Technology | FLASH - NAND (MLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 100 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 48-TFSOP (0.724", 18.40mm Width) | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | 0000.00.0000 |
Overview of MT29F512G08CFCBBWP-10:B – IC FLASH 512Gbit Parallel 48‑TSOP I
The MT29F512G08CFCBBWP-10:B is a 512 Gbit non-volatile NAND flash memory device based on MLC (multi-level cell) technology with a parallel memory interface. The device is organized as 64G x 8 and is offered in a 48‑TSOP I (48‑TFSOP, 18.40 mm width) package.
Designed for systems that require high-density parallel NAND storage, the device operates from a 2.7 V to 3.6 V supply and supports a clock frequency up to 100 MHz with an ambient operating temperature range of 0°C to 70°C.
Key Features
- Memory Type Non-volatile NAND flash using MLC (multi-level cell) architecture for high-density data storage in a compact IC.
- Capacity & Organization 512 Gbit total capacity, organized as 64G × 8 to support byte-wide parallel memory access.
- Interface & Performance Parallel memory interface with support for up to 100 MHz clock frequency for synchronous operations.
- Power Single-supply operation from 2.7 V to 3.6 V, matching common 3.0 V system power rails.
- Package 48‑TSOP I (48‑TFSOP, 0.724", 18.40 mm width) surface-mount package suitable for compact board layouts.
- Temperature Range Rated for ambient operating temperatures from 0°C to 70°C (TA).
Typical Applications
- Embedded Systems Provides high-density non-volatile storage for embedded platforms that utilize parallel NAND memory.
- Firmware and Code Storage Stores firmware, boot code, or large lookup tables in systems requiring substantial flash capacity.
- Consumer Electronics Integrates into consumer devices that accept a parallel NAND interface and require multi-gigabit storage.
- Data Storage Expansion Serves as onboard flash memory for designs needing additional non-volatile capacity in a compact TSOP package.
Unique Advantages
- High Density in a Compact Package: 512 Gbit capacity in a 48‑TSOP I package enables large storage without large PCB area impact.
- Byte-Wide Parallel Organization: 64G × 8 organization supports byte-oriented memory access for legacy and parallel-memory system designs.
- Wide Supply Voltage Range: 2.7 V to 3.6 V operation allows compatibility with common 3.0 V system power domains.
- Synchronous Operation up to 100 MHz: Clock support up to 100 MHz enables timing suitable for parallel-NAND interfaces that require higher-frequency operation.
- Commercial Temperature Rating: 0°C to 70°C ambient rating aligns with standard commercial applications and deployments.
- Manufacturer Backing: Produced by Micron Technology Inc., providing supply continuity from an established memory supplier.
Why Choose MT29F512G08CFCBBWP-10:B?
The MT29F512G08CFCBBWP-10:B positions itself as a high-capacity parallel NAND flash solution for designs that require substantial non-volatile storage in a compact TSOP package. Its 512 Gbit MLC organization, byte-wide 64G × 8 layout, and support for up to 100 MHz clocking make it suitable for systems that need parallel flash memory with standard 3.0 V supply compatibility.
This device is well suited to engineers assembling systems that must balance board space, capacity, and compatibility with parallel-NAND interfaces, while adhering to a commercial temperature range and common voltage rails. Sourcing from Micron Technology Inc. provides continuity for production and integration.
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