MT29F512G08CFCBBWP-10ES:B TR
| Part Description |
IC FLASH 512GBIT PAR 48TSOP I |
|---|---|
| Quantity | 854 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 28 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 48-TSOP I | Memory Format | FLASH | Technology | FLASH - NAND (MLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 100 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 48-TFSOP (0.724", 18.40mm Width) | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F512G08CFCBBWP-10ES:B TR – IC FLASH 512GBIT PAR 48TSOP I
The MT29F512G08CFCBBWP-10ES:B TR is a 512 Gbit non-volatile FLASH memory device based on NAND (MLC) technology. It provides parallel memory organization (64G × 8) in a 48‑TSOP I package and is intended for use wherever high-density NAND flash storage is required.
Key characteristics include a 2.7 V to 3.6 V supply range, support for a 100 MHz clock, and an operating ambient temperature range of 0°C to 70°C, making it suitable for standard commercial applications that need dense parallel flash memory in a TSOP form factor.
Key Features
- Memory Type & Technology Non-volatile NAND Flash using MLC technology for multi-level cell storage.
- Density & Organization 512 Gbit capacity organized as 64G × 8, providing high-density storage in a single device.
- Interface & Timing Parallel memory interface with support for a 100 MHz clock frequency for synchronous operation.
- Supply Voltage Operates from 2.7 V to 3.6 V, compatible with common 3.3 V system rails.
- Package 48‑TSOP I (48‑TFSOP, 0.724", 18.40 mm width) supplier device package for board-level integration.
- Operating Temperature Rated for 0°C to 70°C (TA) for commercial temperature range deployments.
Typical Applications
- Non-volatile Storage High-density NAND flash for applications requiring large on-board data or firmware storage.
- Embedded Systems Parallel flash memory for embedded platforms that use TSOP packages and a 3.3 V supply domain.
- Mass Data Retention Device-level storage for systems that need sustained non-volatile capacity in a compact footprint.
Unique Advantages
- High Capacity in a Compact Package: 512 Gbit density in a 48‑TSOP I package enables significant storage without large board area.
- Parallel Interface Support: Parallel memory organization (64G × 8) and 100 MHz clock support integration into parallel-memory architectures.
- Wide Supply Voltage Range: 2.7 V to 3.6 V operation accommodates common system supply rails and simplifies power domain design.
- Commercial Temperature Rating: 0°C to 70°C operability aligns with standard commercial application requirements.
- MLC NAND Technology: Multi-level cell architecture increases effective storage density per package.
Why Choose IC FLASH 512GBIT PAR 48TSOP I?
The MT29F512G08CFCBBWP-10ES:B TR positions itself as a high-density parallel NAND flash option for designs that require large non-volatile capacity in a 48‑TSOP I package. Its 64G × 8 organization, MLC technology and 2.7 V–3.6 V supply make it suitable for commercial embedded designs that prioritize density and board-level integration.
Designers specifying this device benefit from a compact package footprint, parallel interface compatibility, and a defined commercial operating temperature range, making it a practical choice for projects needing robust on-board flash capacity and straightforward power requirements.
If you need pricing, availability, or to request a quote for the MT29F512G08CFCBBWP-10ES:B TR, submit a product inquiry or request a quote through your preferred procurement channel.
