MT29F512G08CMCCBH7-6ITR:C TR
| Part Description |
IC FLASH 512GBIT PAR 152TBGA |
|---|---|
| Quantity | 952 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 152-TBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND (MLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 152-TBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F512G08CMCCBH7-6ITR:C TR – IC FLASH 512GBIT PAR 152TBGA
The MT29F512G08CMCCBH7-6ITR:C TR is a 512 Gbit NAND flash memory device built on FLASH - NAND (MLC) technology. It provides parallel memory access with a 64G x 8 organization and a 166 MHz clock frequency, packaged in a 152-TBGA (14×18) footprint.
This non-volatile memory component is specified for operation from -40°C to 85°C (TA) and supports a 2.7V to 3.6V supply range, enabling deployment where robust parallel flash storage and defined power/temperature envelopes are required.
Key Features
- Memory Technology FLASH - NAND (MLC) non-volatile memory optimized for parallel storage architectures.
- Density & Organization 512 Gbit capacity organized as 64G x 8 to support an 8-bit data bus.
- Interface & Timing Parallel memory interface with a specified clock frequency of 166 MHz for synchronous access timing.
- Voltage Wide supply range of 2.7V ~ 3.6V to accommodate common system power rails.
- Package 152-TBGA (14×18) supplier device package for compact board-level integration.
- Operating Temperature Rated for -40°C ~ 85°C (TA) to support extended temperature environments.
- Mounting Designed as a non-volatile mountable IC suitable for PCB assembly in the specified TBGA package.
Unique Advantages
- Large raw capacity: 512 Gbit memory size supports substantial parallel storage requirements without adding multiple devices.
- Parallel interface with defined clock: 166 MHz clock frequency enables predictable parallel access timing for system designs using an 8-bit data bus.
- Flexible power operation: 2.7V ~ 3.6V supply range allows integration with a range of standard power rails.
- Industry-standard TBGA package: 152-TBGA (14×18) package provides a compact, board-friendly footprint for high-density layouts.
- Extended temperature support: Rated -40°C ~ 85°C (TA) for operation across common commercial and industrial temperature ranges.
- Clear memory organization: 64G x 8 arrangement simplifies addressing and integration with parallel memory controllers.
Why Choose IC FLASH 512GBIT PAR 152TBGA?
This device combines a large 512 Gbit NAND MLC memory array with a parallel interface and a specified 166 MHz clock, packaged in a compact 152-TBGA (14×18). It is positioned for designs that require non-volatile parallel flash storage with defined power and temperature limits.
Engineers and procurement teams seeking a single-device solution for substantial parallel flash capacity will find clear electrical and mechanical parameters—memory size and organization, interface type, voltage range, package, and operating temperature—documented for straightforward evaluation and integration.
Request a quote or contact sales to obtain pricing, lead times, and ordering information for the MT29F512G08CMCCBH7-6ITR:C TR.
