MT29F512G08CMCEBJ4-37ITR:E

IC FLASH 512GBIT PAR 132VBGA
Part Description

IC FLASH 512GBIT PAR 132VBGA

Quantity 852 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package132-VBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND (MLC)
Memory Size512 GbitAccess TimeN/AGradeIndustrial
Clock Frequency267 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging132-VBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization64G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNPENDING ECCNHTS Code8542.32.0071

Overview of MT29F512G08CMCEBJ4-37ITR:E – IC FLASH 512Gbit Parallel 132-VBGA

The MT29F512G08CMCEBJ4-37ITR:E is a 512 Gbit non-volatile NAND flash memory device using MLC (multi-level cell) technology. It is organized as 64G × 8 with a parallel memory interface and operates from a 2.7 V to 3.6 V supply.

This device targets designs that require high-density flash storage in a compact 132-VBGA (12×18) package, with a specified clock frequency of 267 MHz and an operating ambient temperature range of −40°C to 85°C.

Key Features

  • Memory Core & Technology 512 Gbit capacity implemented as 64G × 8 using FLASH - NAND (MLC) technology for high-density non-volatile storage.
  • Interface Parallel memory interface for direct integration with parallel NAND controller architectures.
  • Performance Specified clock frequency of 267 MHz to support device timing requirements.
  • Voltage Wide supply voltage range of 2.7 V to 3.6 V to accommodate common system power rails.
  • Package 132-VBGA package (12×18) for a compact board footprint and high pin density.
  • Operating Temperature Rated for −40°C to 85°C (TA) to support a broad range of ambient conditions.
  • Non-Volatile Storage Designed as non-volatile FLASH memory for persistent data retention across power cycles.

Typical Applications

  • Embedded Storage High-density non-volatile storage for systems that require large on-board flash capacity with a parallel interface.
  • Industrial Equipment Use in equipment with wide ambient temperature requirements, leveraging the −40°C to 85°C operating range.
  • Data Logging and Archival Persistent MLC NAND storage for applications that need mass storage in a compact package.

Unique Advantages

  • High Density Storage: 512 Gbit capacity supports designs that need large flash memory on a single device.
  • Parallel Interface Compatibility: Parallel memory interface simplifies integration with parallel NAND controller designs.
  • Compact VBGA Packaging: 132-VBGA (12×18) package delivers high pin density in a space-efficient footprint.
  • Flexible Power Range: 2.7 V to 3.6 V supply range fits common system power rails and simplifies power domain design.
  • Wide Temperature Operation: −40°C to 85°C rating supports deployment across a broad range of ambient conditions.
  • MLC NAND Technology: Multi-level cell flash format provides higher bit density per die for capacity-optimized designs.

Why Choose MT29F512G08CMCEBJ4-37ITR:E?

This Micron 512 Gbit parallel NAND flash device is positioned for designs that require high-capacity, non-volatile memory in a compact 132-VBGA package with flexible power and temperature tolerances. Its 64G × 8 organization and MLC technology deliver substantial on-board storage where board space and density matter.

Choose this device for applications that need verifiable electrical and environmental parameters—such as clock frequency, voltage range, organization, and package—documented for straightforward hardware integration and long-term design planning.

Request a quote or contact sales for pricing, availability, and lead-time information for the MT29F512G08CMCEBJ4-37ITR:E.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up