MT29F512G08CUAAAC5:A

IC FLASH 512GBIT PARALLEL 52VLGA
Part Description

IC FLASH 512GBIT PARALLEL 52VLGA

Quantity 500 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package52-VLGA (18x14)Memory FormatFLASHTechnologyFLASH - NAND (MLC)
Memory Size512 GbitAccess TimeN/AGradeCommercial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging52-VLGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization64G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F512G08CUAAAC5:A – IC FLASH 512GBIT PARALLEL 52VLGA

The MT29F512G08CUAAAC5:A is a 512 Gbit non-volatile FLASH memory device implemented as NAND (MLC) technology with a parallel memory interface. It provides high-density storage in a 52-VLGA (18×14) package and operates from a 2.7 V to 3.6 V supply.

This device is intended for systems that require large-capacity parallel FLASH memory with defined operating conditions, including an ambient temperature range of 0°C to 70°C.

Key Features

  • Memory Type & Technology Non-volatile FLASH memory using NAND (MLC) technology, suitable for multi-level cell storage requirements.
  • Capacity & Organization 512 Gbit total capacity organized as 64G × 8 for straightforward bus mapping and addressing.
  • Interface Parallel memory interface for integration into parallel bus systems.
  • Voltage Supply Single-supply operation from 2.7 V to 3.6 V.
  • Package 52-VLGA package (18 × 14 mm) offering a compact footprint for board-level integration.
  • Operating Temperature Rated for ambient operation from 0°C to 70°C (TA).

Unique Advantages

  • High-density storage: 512 Gbit capacity supports large data storage needs within a single package footprint.
  • Parallel interface: Enables integration into systems that use parallel memory buses without protocol conversion.
  • MLC NAND technology: Multi-level cell FLASH provides the specified large capacity in a compact device.
  • Compact package: 52-VLGA (18×14) package minimizes board area while housing high memory density.
  • <strong_Wide supply range: Operation across 2.7 V to 3.6 V accommodates common 3 V system rails.

Why Choose MT29F512G08CUAAAC5:A?

The MT29F512G08CUAAAC5:A is positioned as a high-density, parallel NAND FLASH memory device that provides 512 Gbit of non-volatile storage in a compact 52-VLGA package. Its MLC NAND architecture and 64G × 8 organization make it suitable for designs that require substantial on-board storage with a parallel memory interface and a 2.7 V–3.6 V supply.

With a specified ambient operating range of 0°C to 70°C, this device fits applications with standard commercial temperature requirements where a compact, high-capacity FLASH solution is needed.

Request a quote or contact sales to discuss pricing, lead times, and availability for MT29F512G08CUAAAC5:A.

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