MT29F512G08CUCABH3-12ITZ:A TR

IC FLASH 512GBIT PAR 100LBGA
Part Description

IC FLASH 512GBIT PAR 100LBGA

Quantity 941 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-LBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND (MLC)
Memory Size512 GbitAccess TimeN/AGradeCommercial
Clock Frequency83 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging100-LBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization64G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F512G08CUCABH3-12ITZ:A TR – 512 Gbit NAND MLC Flash, Parallel Interface, 100-LBGA

The MT29F512G08CUCABH3-12ITZ:A TR from Micron Technology Inc. is a 512 Gbit non-volatile NAND flash memory device using MLC technology. It is organized as 64G x 8 and provides a parallel memory interface in a 100-LBGA (12×18) package.

This device targets designs that require high-density parallel flash storage with a defined operating range and standard supply voltage. Key electrical and mechanical parameters include an 83 MHz clock frequency, 2.7 V to 3.6 V supply range, and a 0°C to 70°C ambient operating temperature.

Key Features

  • Memory Technology NAND flash, Multi-Level Cell (MLC) non-volatile memory format.
  • Density & Organization 512 Gbit total capacity organized as 64G × 8.
  • Interface & Timing Parallel memory interface with an 83 MHz clock frequency.
  • Power Supply voltage range of 2.7 V to 3.6 V.
  • Package 100-LBGA package, 12×18 mm footprint.
  • Operating Temperature Specified for 0°C to 70°C (TA).
  • Manufacturer Manufactured by Micron Technology Inc.

Unique Advantages

  • High-density storage: 512 Gbit capacity (64G × 8) provides substantial non-volatile memory in a single device.
  • Parallel interface for integration: Parallel memory interface and 83 MHz clock facilitate direct connection to parallel memory controllers.
  • Standard supply compatibility: 2.7 V to 3.6 V supply range aligns with common system power rails.
  • Compact LBGA package: 100-LBGA (12×18) offers a space-efficient footprint for board-level integration.
  • Commercial temperature rating: Operates across a 0°C to 70°C ambient range for standard commercial applications.

Why Choose IC FLASH 512GBIT PAR 100LBGA?

The MT29F512G08CUCABH3-12ITZ:A TR combines substantial 512 Gbit NAND MLC capacity with a parallel interface and a compact 100-LBGA package, making it suitable for designs that require large non-volatile storage within a constrained footprint. Its defined clock and supply requirements simplify electrical integration into platforms that support parallel flash.

Engineers and procurement teams seeking a high-density parallel NAND flash device with clear electrical and mechanical specifications can consider this Micron-manufactured part for commercial-temperature applications where the stated supply, clock, and package parameters match system requirements.

Request a quote or contact sales to discuss pricing and availability for MT29F512G08CUCABH3-12ITZ:A TR.

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