MT29F512G08EEHAFJ4-3R:A TR

IC FLASH 512GBIT PAR 132VBGA
Part Description

IC FLASH 512GBIT PAR 132VBGA

Quantity 114 Available (as of May 26, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks

Specifications & Environmental

Device Package132-VBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND (TLC)
Memory Size512 GbitAccess TimeN/AGradeCommercial
Clock Frequency333 MHzVoltage2.5V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging132-VBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization64G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F512G08EEHAFJ4-3R:A TR – IC FLASH 512GBIT PAR 132VBGA

The MT29F512G08EEHAFJ4-3R:A TR is a 512 Gbit parallel NAND flash memory device featuring Triple-Level Cell (TLC) technology. It provides high-density, non-volatile storage in a 132-VBGA (12×18) package and operates over a 2.5 V to 3.6 V supply range.

Designed for systems that require parallel flash memory, this device offers a 64G × 8 organization and supports a 333 MHz clock frequency, making it suitable for embedded storage subsystems and other applications that accept parallel NAND flash components.

Key Features

  • Memory Core 512 Gbit non-volatile NAND flash using TLC (Triple-Level Cell) technology for high-density storage.
  • Memory Organization Configured as 64G × 8 to support byte-wide parallel access and straightforward memory mapping.
  • Interface & Performance Parallel memory interface with a supported clock frequency of 333 MHz for synchronous operation.
  • Power Wide supply range from 2.5 V to 3.6 V to accommodate varying system power rails.
  • Package 132-VBGA (12×18) package case providing a compact footprint for board-level integration.
  • Operating Temperature Specified operating ambient temperature range of 0°C to 70°C (TA).

Typical Applications

  • Embedded storage subsystems — Provides high-density, non-volatile storage for systems that accept parallel NAND flash devices.
  • Firmware and code storage — Stores system firmware and code images in a parallel flash memory format.
  • Data buffering and local mass storage — Serves as a high-capacity storage element in designs requiring parallel NAND memory.

Unique Advantages

  • High storage density: 512 Gbit capacity enables significant on-board non-volatile storage within a single package.
  • Parallel interface compatibility: 64G × 8 organization and parallel access suit legacy and existing parallel-NAND architectures.
  • Flexible supply range: Operates from 2.5 V to 3.6 V, supporting systems with differing power rails.
  • Compact VBGA package: 132-VBGA (12×18) package allows integration in space-constrained board designs.
  • Specified operating range: Rated for 0°C to 70°C ambient operation to match commercial temperature system requirements.
  • TLC NAND technology: Triple-Level Cell implementation provides greater bit density per die for capacity-focused designs.

Why Choose IC FLASH 512GBIT PAR 132VBGA?

The MT29F512G08EEHAFJ4-3R:A TR positions itself as a high-density, parallel NAND flash memory option offering a balance of capacity and integration-friendly packaging. Its 512 Gbit TLC organization, parallel interface, and 132-VBGA package make it suitable for designs that require substantial non-volatile storage in a compact form factor.

Engineers and procurement teams specifying this device will benefit from its clear electrical and mechanical parameters—64G × 8 organization, 333 MHz clock support, 2.5 V–3.6 V supply range, and 0°C to 70°C operating range—when evaluating fit for embedded storage, firmware retention, or local mass storage applications.

Request a quote or contact sales to discuss availability, pricing, and to submit a purchase inquiry for the MT29F512G08EEHAFJ4-3R:A TR IC FLASH 512GBIT PAR 132VBGA.

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