MT29F64G08AEEDBJ4-12:D

IC FLASH 64GBIT PAR 132VBGA
Part Description

IC FLASH 64GBIT PAR 132VBGA

Quantity 1,646 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package132-VBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeCommercial
Clock Frequency83 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging132-VBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNOBSOLETEHTS Code0000.00.0000

Overview of MT29F64G08AEEDBJ4-12:D – IC FLASH 64GBIT PAR 132VBGA

The MT29F64G08AEEDBJ4-12:D is a 64 Gbit non-volatile FLASH memory device based on NAND technology with an 8G × 8 memory organization. It provides parallel memory interfacing in a 132-VBGA (12×18) package and operates from a 2.7 V to 3.6 V supply.

Because its key electrical and mechanical attributes are documented—capacity, organization, parallel interface, clock frequency, supply voltage and operating temperature—this device is specified for designs that require a parallel NAND flash memory solution in a compact BGA footprint.

Key Features

  • Memory Capacity and Organization 64 Gbit total capacity arranged as 8G × 8, enabling large non-volatile storage in a single device.
  • Technology NAND flash non-volatile memory providing persistent data retention without power.
  • Interface and Performance Parallel memory interface with a clock frequency of 83 MHz for synchronous parallel operation.
  • Power Wide supply range from 2.7 V to 3.6 V to accommodate common 3 V system rails.
  • Package 132-VBGA package (12 × 18 mm) offering a compact BGA form factor for board-level integration.
  • Operating Temperature Rated for 0°C to 70°C ambient (TA), suitable for standard commercial temperature environments.

Unique Advantages

  • High-density storage: 64 Gbit capacity in an 8G × 8 organization provides substantial non-volatile storage in a single device.
  • Parallel interface throughput: 83 MHz clock frequency with a parallel interface supports designs that require synchronous parallel flash access.
  • Standard 3 V supply compatibility: 2.7 V–3.6 V supply range aligns with common 3.3 V and 3.0 V system rails for straightforward power integration.
  • Compact BGA packaging: 132-VBGA (12×18) package reduces board area while providing a robust ball-grid mounting option.
  • Commercial temperature rating: 0°C–70°C operating range meets typical commercial application environment requirements.

Why Choose IC FLASH 64GBIT PAR 132VBGA?

The MT29F64G08AEEDBJ4-12:D positions itself as a high-capacity parallel NAND flash component with clear, verifiable electrical and mechanical specifications. Its combination of 64 Gbit density, parallel interface at 83 MHz, and a compact 132-VBGA package makes it suitable for designs that require substantial non-volatile storage in a space-efficient form factor while operating from standard 3 V rails.

This device is appropriate for customers specifying parallel NAND flash with defined supply and temperature limits and who require an explicit package footprint for board-level planning. Its documented specs support straightforward integration decisions around capacity, interface timing, power, and thermal environment.

Request a quote or contact sales to discuss pricing, lead times and availability for the MT29F64G08AEEDBJ4-12:D.

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