MT40A8G4BAF-062E:B

The MT40A8G4BAF-062E:B is a 32 Gbit DRAM device in a 78-FBGA package from the TwinDie™ series. It is specified as SDRAM - DDR4 technology with a parallel memory interface and a memory organization of 8G × 4.

Designed for systems that require high-density parallel DDR4 memory, the device targets applications where 32 Gbit capacity, a 1.6 GHz clock frequency, and a compact BGA footprint are primary considerations. Its specified operating temperature and supply voltage range support deployment in environments that match those limits.

Key Features

• Memory and Architecture 32 Gbit capacity arranged as 8G × 4, specified as SDRAM - DDR4 and listed in the TwinDie™ series.
• Performance Clock frequency specified at 1.6 GHz with an access time of 13.75 ns.
• Interface Parallel memory interface for systems designed to accept parallel DDR4 memory modules.
• Power Supply voltage range specified at 1.14 V to 1.26 V.
• Package 78-TFBGA package case; supplier device package listed as 78-FBGA (10.5 × 11 mm).
• Operating Range Case operating temperature specified from 0°C to 95°C (TC).
• Memory Type / Mounting MemoryType and MountingType are listed as Non-Volatile in the product data.

Typical Applications

• High-density memory subsystems — Use where a 32 Gbit DDR4 parallel memory element is required for system memory capacity planning.
• Communications and networking equipment — Applicable to designs that specify parallel DDR4 memory at a 1.6 GHz clock frequency and tight access-time requirements.
• Industrial controllers and embedded systems — Suited to systems that operate within the specified 0°C to 95°C case temperature range and require the specified package footprint.

Unique Advantages

• 32 Gbit capacity: Provides a high-density memory option for designs needing 8G × 4 organization in a single device.
• DDR4 operation at 1.6 GHz: Supports a high clock frequency as specified for designs targeting this performance point.
• Deterministic access time: Access time specified at 13.75 ns for system timing and memory performance planning.
• Compact 78-FBGA package (10.5 × 11 mm): Small BGA footprint for space-constrained PCB layouts.
• Defined supply voltage range: 1.14 V to 1.26 V supply specification aids in power budgeting and design margining.
• Specified operating temperature: Case temperature range of 0°C to 95°C for applications matching that thermal envelope.

Why Choose IC DRAM 32GBIT PARALLEL 78FBGA?

The MT40A8G4BAF-062E:B positions itself as a high-density DDR4 parallel memory device with clearly defined electrical, timing, and thermal specifications. Its 32 Gbit capacity, 1.6 GHz clock rating, and compact 78-FBGA package make it suitable for designs that require predictable DDR4 behavior within the provided voltage and temperature ranges.

This product is appropriate for engineers and procurement teams specifying a 32 Gbit parallel DDR4 component in a BGA footprint and who need the documented access time, supply voltage, and operating temperature information to assess fit and integration into their systems.

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