MT40A8G4CLU-062H:E

The MT40A8G4CLU-062H:E from Micron Technology Inc. is a 32 Gbit parallel DRAM device in the TwinDie™ series implementing DDR4 SDRAM technology. It is supplied in a 78-TFBGA (78-FBGA, 7.5×11 mm) package for board-level integration.

This device offers a 1.6 GHz clock frequency and a 13.75 ns access time while operating from a 1.14 V to 1.26 V supply and across an operating temperature range of 0°C to 95°C (TC), making it suitable for designs that require high-density parallel DDR4 memory with defined electrical and thermal characteristics.

Key Features

• Core / Architecture  DDR4 SDRAM technology within Micron's TwinDie™ series, providing a parallel DRAM architecture.
• Memory Capacity & Organization  32 Gbit total capacity organized as 8G × 4.
• Performance  1.6 GHz clock frequency with a 13.75 ns access time for timing-sensitive memory operations.
• Memory Interface  Parallel memory interface suitable for board-level DRAM integration.
• Power  Operates from a 1.14 V to 1.26 V supply range.
• Package  78-TFBGA (78-FBGA, 7.5×11 mm) supplier device package for compact mounting.
• Operating Temperature  Rated for 0°C to 95°C (TC).
• Memory Type & Format  Listed as Non-Volatile and formatted as DRAM in the product specification.
• Mounting Type  Specified as Non-Volatile mounting type in product data.

Typical Applications

• High-density memory subsystems  For designs requiring 32 Gbit of parallel DDR4 memory capacity at the component level.
• High-speed buffering and caching  Suited to buffering and caching functions that benefit from a 1.6 GHz clock and 13.75 ns access time.
• Compact board-level implementations  The 78-FBGA (7.5×11 mm) package supports space-constrained PCB layouts requiring on-board DRAM.

Unique Advantages

• High-density 32 Gbit capacity: Enables increased memory per component with an 8G × 4 organization.
• DDR4 performance: 1.6 GHz clock frequency and 13.75 ns access time provide defined timing for performance-sensitive systems.
• Low-voltage operation: Narrow 1.14 V to 1.26 V supply range supports consistent power-domain design.
• Compact FBGA package: 78-TFBGA (7.5×11 mm) package allows for board-level density and small footprint integration.
• Extended thermal operating range: Rated 0°C to 95°C (TC) to address a range of thermal environments.
• TwinDie™ series integration: Identified as part of Micron's TwinDie™ series for consistent product family characteristics.

Why Choose MT40A8G4CLU-062H:E?

The MT40A8G4CLU-062H:E positions itself as a high-density DDR4 parallel DRAM component with specified clocking, timing, voltage, and thermal characteristics. Its 32 Gbit capacity, 1.6 GHz clock frequency, and compact 78-FBGA package make it appropriate for designs that require on-board parallel DDR4 memory with defined electrical and mechanical parameters.

This device is suitable for engineers and procurement teams targeting board-level memory integration where capacity, timing, package footprint, and operating range are key selection criteria, offering a predictable specification set for system-level planning and deployment.

Request a quote or contact sales to discuss availability, volume pricing, and technical details for the MT40A8G4CLU-062H:E.