MT40A8G4CLU-075H:E TR

The MT40A8G4CLU-075H:E TR is a 32 Gbit DDR4 SDRAM device in a parallel memory format. It provides 8G x 4 organization and is delivered in a 78-TFBGA (78-FBGA, 7.5×11) package.

Designed for systems that require high-density DDR4 memory, this device offers a 1.33 GHz clock frequency, 27 ns access time, and an operating temperature range up to 95°C, with a nominal supply voltage range of 1.14 V to 1.26 V.

Key Features

• Core / Memory  32 Gbit memory capacity organized as 8G × 4; memory format specified as DRAM with Technology listed as SDRAM - DDR4.
• Performance  Clock frequency of 1.33 GHz and an access time of 27 ns as provided in the product specifications.
• Interface  Parallel memory interface suitable for designs that integrate parallel DDR4 DRAM devices.
• Power  Specified supply voltage range of 1.14 V to 1.26 V to support DDR4 operating conditions.
• Package  Supplied in a 78-TFBGA package (78-FBGA, 7.5×11), enabling compact board-level integration.
• Temperature Range  Operating temperature range from 0°C to 95°C (TC) for thermally demanding environments.
• Product Data Notes  Product fields include "MemoryType" and "MountingType" listed as Non-Volatile in the provided specification set.

Typical Applications

• High-density DRAM modules  Used where 32 Gbit DDR4 parallel memory is required to meet board-level capacity targets.
• Embedded systems with parallel DDR4  Integrates into systems that use parallel DDR4 interfaces and require compact FBGA packaging.
• Industrial electronics  Suitable for equipment operating within the specified 0°C to 95°C temperature range.
• Memory subsystems  Serves as a component in memory subsystems that specify 8G × 4 organization and DDR4 SDRAM technology.

Unique Advantages

• High memory capacity: 32 Gbit device density supports designs requiring significant on-board DRAM capacity.
• DDR4 performance: 1.33 GHz clock frequency and 27 ns access time provide specification-level performance details for system designers.
• Compact BGA package: 78-TFBGA (78-FBGA, 7.5×11) package enables integration into space-constrained PCB layouts.
• Defined operating range: Operating temperature from 0°C to 95°C and a clear supply voltage window (1.14 V–1.26 V) allow predictable thermal and power planning.
• Clear memory organization: 8G × 4 organization simplifies capacity planning and memory mapping for parallel DDR4 implementations.

Why Choose MT40A8G4CLU-075H:E TR?

The MT40A8G4CLU-075H:E TR delivers a high-density DDR4 SDRAM option in a compact 78-FBGA package, with documented clock frequency, access time, voltage range, and operating temperature to support engineered integration. Its 8G × 4 organization and 32 Gbit capacity make it suitable for designs that specify parallel DDR4 memory components.

Provided by Micron Technology Inc., this device is positioned for designs where clear, spec-driven memory characteristics—capacity, clocking, access time, package, power, and temperature—are required for reliable system-level planning and implementation.

For pricing, availability, or to request a quote for MT40A8G4CLU-075H:E TR, please submit your request to the sales team or request a formal quote through our standard procurement channels.