MT40A8G4KVA-075H:G

IC DRAM 32GBIT PARALLEL 78FBGA
Part Description

IC DRAM 32GBIT PARALLEL 78FBGA

Quantity 501 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package78-FBGA (8x12)Memory FormatDRAMTechnologySDRAM - DDR4
Memory Size32 GbitAccess Time27 nsGradeExtended / Automotive-like
Clock Frequency1.33 GHzVoltage1.14V ~ 1.26VMemory TypeNon-Volatile
Operating Temperature0°C ~ 95°C (TC)Write Cycle Time Word PageN/APackaging78-TFBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 4
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCNOBSOLETEHTS Code0000.00.0000

Overview of MT40A8G4KVA-075H:G – IC DRAM 32GBIT PARALLEL 78FBGA

The MT40A8G4KVA-075H:G is a 32 Gbit DRAM device implemented in SDRAM - DDR4 technology and delivered in a 78-TFBGA (78-FBGA, 8×12) package. It provides a parallel memory interface with a 1.33 GHz clock frequency and an 8G × 4 memory organization.

Designed for systems that require a defined DDR4 memory element, the device specifies operating parameters including a 1.14 V–1.26 V supply range, 27 ns access time, and an operating temperature range of 0°C to 95°C (TC).

Key Features

  • Technology SDRAM - DDR4 technology as specified for the device.
  • Memory Capacity & Organization 32 Gbit total memory, organized as 8G × 4.
  • Clock Frequency 1.33 GHz clock frequency for synchronous operation.
  • Access Time Specified access time of 27 ns.
  • Voltage Supply Operates over a 1.14 V to 1.26 V supply range.
  • Package 78-TFBGA / 78-FBGA (8×12) BGA package footprint.
  • Memory Interface Parallel memory interface.
  • Operating Temperature Rated for 0°C to 95°C (TC).
  • Mounting Type Specified as Non-Volatile mounting type in device data.

Unique Advantages

  • Specified 32 Gbit capacity: Provides a defined 32 Gbit density in an 8G × 4 organization for applications requiring that memory size.
  • DDR4 SDRAM implementation: DDR4 SDRAM technology with a 1.33 GHz clock frequency and 27 ns access time as stated in the device data.
  • Compact BGA package: 78-TFBGA (78-FBGA, 8×12) package format for BGA-style board mounting.
  • Defined supply voltage range: Operation across 1.14 V to 1.26 V simplifies power budgeting to the specified rails.
  • Operational temperature window: Rated from 0°C to 95°C (TC), enabling use within that specified thermal range.

Why Choose IC DRAM 32GBIT PARALLEL 78FBGA?

The MT40A8G4KVA-075H:G positions itself as a specified DDR4 SDRAM component that combines a 32 Gbit density, parallel interface, and defined electrical and thermal parameters. Its published clock, access time, supply voltage range, and package details support straightforward integration where those exact specifications are required.

This device is appropriate for designs that require a 32 Gbit parallel DRAM element in a 78-FBGA footprint and that operate within the listed voltage and temperature ranges. The clear, itemized specifications simplify selection and system-level validation for engineers and procurement teams.

Request a quote or submit an inquiry to obtain pricing and availability for the MT40A8G4KVA-075H:G.

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