MT40A8G4KVA-075H:G TR

The MT40A8G4KVA-075H:G TR is a 32 Gbit DRAM device implemented with DDR4 SDRAM technology and a parallel memory interface. It delivers high-density memory organization in an industry-standard 78‑TFBGA (8×12) package for systems that require compact, board-mount DRAM.

Key characteristics include an 8G × 4 memory organization, a 1.33 GHz clock frequency, and a specified operating temperature range of 0°C to 95°C, providing a balance of density and performance for embedded and compute applications operating within that thermal window.

Key Features

• Memory Technology DDR4 SDRAM architecture providing parallel DRAM operation as specified.
• Density & Organization 32 Gbit capacity organized as 8G × 4 for high-density memory integration.
• Performance 1.33 GHz clock frequency and a listed access time of 27 ns for timing-sensitive applications.
• Voltage Supply voltage range of 1.14 V to 1.26 V to match DDR4 system power domains.
• Package & Mounting 78‑TFBGA (78‑FBGA, 8×12) supplier device package for surface-mount assembly; mounting type recorded as Non-Volatile.
• Interface Parallel memory interface suitable for designs requiring parallel DDR4 connectivity.
• Environmental Range Specified operating temperature of 0°C to 95°C (TC) for systems operating within that temperature window.

Typical Applications

• Embedded and Compute Platforms — Provides 32 Gbit DDR4 storage in systems that require parallel DRAM connectivity and high memory density.
• Board-Level Memory Expansion — Suited for designs needing compact, surface-mount DRAM in a 78‑FBGA package footprint.
• Thermally-Constrained Systems — Applicable where operation within 0°C to 95°C is required and a DDR4 memory interface is specified.

Unique Advantages

• High Memory Density: 32 Gbit capacity minimizes the number of devices needed to achieve large memory sizes.
• DDR4 Performance: 1.33 GHz clock frequency and 27 ns access time provide defined timing characteristics for system design.
• Compact Package: 78‑TFBGA (8×12) package supports surface-mount assembly and compact board layouts.
• Low-Voltage Operation: 1.14 V to 1.26 V supply range aligns with DDR4 power domains for consistent integration.
• Parallel Interface: Parallel memory interface allows integration into systems designed for parallel DDR4 DRAM.

Why Choose IC DRAM 32GBIT PARALLEL 78FBGA?

IC DRAM 32GBIT PARALLEL 78FBGA (MT40A8G4KVA-075H:G TR) combines 32 Gbit DDR4 SDRAM density with a parallel interface and defined timing and voltage specifications, making it suitable for designs that prioritize on-board memory capacity in a compact 78‑TFBGA package. Its documented clock frequency, access time, and operating temperature range provide concrete parameters for system-level integration and thermal planning.

This device is well suited to engineers and procurement teams specifying high-density parallel DDR4 memory for embedded and compute systems that operate within the listed electrical and thermal ranges. The clear, verifiable specifications support predictable integration and long-term design planning.

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