MT46V128M4TG-5B:D TR
| Part Description |
IC DRAM 512MBIT PARALLEL 66TSOP |
|---|---|
| Quantity | 1,094 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 700 ps | Grade | Commercial | ||
| Clock Frequency | 200 MHz | Voltage | 2.5V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 128M x 4 | ||
| Moisture Sensitivity Level | 4 (72 Hours) | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT46V128M4TG-5B:D TR – IC DRAM 512MBIT PARALLEL 66TSOP
The MT46V128M4TG-5B:D TR is a 512 Mbit DDR SDRAM organized as 128M × 4 with a parallel memory interface in a 66‑pin TSSOP package. It implements an internal, pipelined double-data-rate architecture to deliver two data transfers per clock cycle and supports a clock rate up to 200 MHz.
This device is intended for systems requiring a compact, 2.5 V DDR memory element with programmable burst lengths, four internal banks for concurrent operation, and commercial temperature operation (0°C to +70°C).
Key Features
- DDR architecture Internal pipelined double-data-rate operation provides two data accesses per clock cycle for higher effective bandwidth.
- Memory organization and capacity 512 Mbit capacity organized as 128M × 4 with four internal banks (32 Meg × 4 × 4 banks).
- Timing and performance Speed grade -5B supports a 200 MHz clock frequency (DDR400 timing) with an access time of 700 ps and a 15 ns write cycle time (word page).
- Data and clock interfaces Differential clock inputs (CK/CK#) and bidirectional data strobe (DQS) for source‑synchronous data capture; DLL aligns DQ/DQS with CK.
- Programmable burst and refresh Programmable burst lengths of 2, 4, or 8; auto refresh with 8192 refresh cycles (64 ms for commercial devices).
- I/O and signaling 2.5 V I/O (SSTL_2 compatible) and data mask (DM) support for masked writes.
- Package and thermal 66‑pin TSSOP (0.400", 10.16 mm width) package with commercial ambient operating range of 0°C to +70°C.
- System options and reliability Features concurrent auto precharge and tRAS lockout support to aid memory transaction control and reliability.
Typical Applications
- Embedded memory subsystems — Provides 512 Mbit DDR SDRAM capacity in a compact 66‑TSSOP package for space‑constrained boards requiring standard DDR signaling.
- Consumer and commercial electronics — Suitable for designs that require DDR memory with programmable burst lengths, auto refresh, and standard 2.5 V I/O.
- Legacy DDR system designs — Supports established DDR timing grades and common DDR control features (DQS, DLL, differential clock) for integration into existing DDR architectures.
Unique Advantages
- High effective data rate: Double-data-rate operation with 200 MHz clocking enables two transfers per cycle for increased throughput.
- Compact board footprint: 66‑TSSOP package (10.16 mm width) offers a small form factor for dense PCB layouts.
- Flexible timing modes: Programmable burst lengths (2, 4, 8) and defined speed-grade timing (-5B) provide adaptable performance to match system requirements.
- Standard 2.5 V I/O: SSTL_2 compatible signaling simplifies interface design with common DDR I/O standards.
- Concurrency and control: Four internal banks plus concurrent auto precharge support improve memory access efficiency in multi‑bank workloads.
- Commercial temperature rating: Rated for operation from 0°C to +70°C for a broad range of commercial applications.
Why Choose MT46V128M4TG-5B:D TR?
The MT46V128M4TG-5B:D TR delivers a proven DDR SDRAM feature set—including DDR pipelined architecture, DQS/DLL timing support, and programmable burst lengths—in a compact 66‑pin TSSOP package. Its 512 Mbit capacity (128M × 4) and four internal banks provide a balance of density and concurrent-access capability for systems that require standard 2.5 V DDR memory.
This part is well suited to designs that prioritize integration into established DDR signaling environments, compact PCB footprints, and commercial-temperature operation. Its defined timing grade and interface features help simplify memory subsystem design and timing closure for engineers working with parallel DDR memory architectures.
Request a quote or submit a pricing inquiry to obtain lead-time and availability details for the MT46V128M4TG-5B:D TR.