MT46V128M4TG-5B:D TR

IC DRAM 512MBIT PARALLEL 66TSOP
Part Description

IC DRAM 512MBIT PARALLEL 66TSOP

Quantity 1,094 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOPMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.5V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization128M x 4
Moisture Sensitivity Level4 (72 Hours)RoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V128M4TG-5B:D TR – IC DRAM 512MBIT PARALLEL 66TSOP

The MT46V128M4TG-5B:D TR is a 512 Mbit DDR SDRAM organized as 128M × 4 with a parallel memory interface in a 66‑pin TSSOP package. It implements an internal, pipelined double-data-rate architecture to deliver two data transfers per clock cycle and supports a clock rate up to 200 MHz.

This device is intended for systems requiring a compact, 2.5 V DDR memory element with programmable burst lengths, four internal banks for concurrent operation, and commercial temperature operation (0°C to +70°C).

Key Features

  • DDR architecture Internal pipelined double-data-rate operation provides two data accesses per clock cycle for higher effective bandwidth.
  • Memory organization and capacity 512 Mbit capacity organized as 128M × 4 with four internal banks (32 Meg × 4 × 4 banks).
  • Timing and performance Speed grade -5B supports a 200 MHz clock frequency (DDR400 timing) with an access time of 700 ps and a 15 ns write cycle time (word page).
  • Data and clock interfaces Differential clock inputs (CK/CK#) and bidirectional data strobe (DQS) for source‑synchronous data capture; DLL aligns DQ/DQS with CK.
  • Programmable burst and refresh Programmable burst lengths of 2, 4, or 8; auto refresh with 8192 refresh cycles (64 ms for commercial devices).
  • I/O and signaling 2.5 V I/O (SSTL_2 compatible) and data mask (DM) support for masked writes.
  • Package and thermal 66‑pin TSSOP (0.400", 10.16 mm width) package with commercial ambient operating range of 0°C to +70°C.
  • System options and reliability Features concurrent auto precharge and tRAS lockout support to aid memory transaction control and reliability.

Typical Applications

  • Embedded memory subsystems — Provides 512 Mbit DDR SDRAM capacity in a compact 66‑TSSOP package for space‑constrained boards requiring standard DDR signaling.
  • Consumer and commercial electronics — Suitable for designs that require DDR memory with programmable burst lengths, auto refresh, and standard 2.5 V I/O.
  • Legacy DDR system designs — Supports established DDR timing grades and common DDR control features (DQS, DLL, differential clock) for integration into existing DDR architectures.

Unique Advantages

  • High effective data rate: Double-data-rate operation with 200 MHz clocking enables two transfers per cycle for increased throughput.
  • Compact board footprint: 66‑TSSOP package (10.16 mm width) offers a small form factor for dense PCB layouts.
  • Flexible timing modes: Programmable burst lengths (2, 4, 8) and defined speed-grade timing (-5B) provide adaptable performance to match system requirements.
  • Standard 2.5 V I/O: SSTL_2 compatible signaling simplifies interface design with common DDR I/O standards.
  • Concurrency and control: Four internal banks plus concurrent auto precharge support improve memory access efficiency in multi‑bank workloads.
  • Commercial temperature rating: Rated for operation from 0°C to +70°C for a broad range of commercial applications.

Why Choose MT46V128M4TG-5B:D TR?

The MT46V128M4TG-5B:D TR delivers a proven DDR SDRAM feature set—including DDR pipelined architecture, DQS/DLL timing support, and programmable burst lengths—in a compact 66‑pin TSSOP package. Its 512 Mbit capacity (128M × 4) and four internal banks provide a balance of density and concurrent-access capability for systems that require standard 2.5 V DDR memory.

This part is well suited to designs that prioritize integration into established DDR signaling environments, compact PCB footprints, and commercial-temperature operation. Its defined timing grade and interface features help simplify memory subsystem design and timing closure for engineers working with parallel DDR memory architectures.

Request a quote or submit a pricing inquiry to obtain lead-time and availability details for the MT46V128M4TG-5B:D TR.

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