MT46V16M16CY-5B AIT:M TR

IC DRAM 256MBIT PARALLEL 60FBGA
Part Description

IC DRAM 256MBIT PARALLEL 60FBGA

Quantity 530 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package60-FBGA (8x12.5)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size256 MbitAccess Time700 psGradeAutomotive
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationAEC-Q100ECCNEAR99HTS Code8542.32.0036

Overview of MT46V16M16CY-5B AIT:M TR – IC DRAM 256MBIT PARALLEL 60FBGA

The MT46V16M16CY-5B AIT:M TR is a 256 Mbit DDR SDRAM device organized as 16M × 16 with a parallel memory interface in a 60-ball FBGA package. It implements an internal, pipelined double-data-rate architecture with source-synchronous data capture and differential clock inputs for synchronous DDR operation.

Designed for designs requiring compact, qualified DDR memory, the device provides automotive-grade qualification and industrial temperature range support, offering deterministic timing features and standard DDR functionality such as programmable burst lengths, auto refresh and self refresh (variant dependent).

Key Features

  • Core Architecture Internal pipelined DDR architecture enabling two data accesses per clock cycle and a DLL to align DQ and DQS transitions with the clock.
  • Memory Organization 256 Mbit capacity arranged as 16M × 16 with four internal banks for concurrent operation.
  • Performance & Timing 200 MHz clock frequency (–5B grade) with an access window and data-out timing appropriate for CL = 3 operation; access time listed as 700 ps and write cycle time (word page) of 15 ns.
  • Data Timing and I/O Bidirectional data strobe (DQS) transmitted/received with data for source-synchronous capture (x16 has two DQS signals, one per byte). Differential clock inputs (CK/CK#) and data mask (DM) support (x16 has two DMs, one per byte).
  • Programmable Operation Programmable burst lengths of 2, 4, or 8 and support for concurrent auto precharge and auto refresh (8192-cycle refresh counts as specified).
  • Power Supply voltage range 2.3 V to 2.7 V; I/O signaling compatible with 2.5 V I/O levels as documented.
  • Package & Mounting 60-ball thin FBGA package (8 mm × 12.5 mm) for compact board footprint and surface-mount assembly.
  • Temperature & Qualification Operating temperature range –40 °C to +85 °C (TA) with AEC-Q100 qualification and automotive-oriented documentation (PPAP submission and 8D response noted).

Typical Applications

  • Automotive control modules — Automotive-qualified DDR memory for embedded controllers and modules requiring AEC-Q100 qualification and extended temperature range.
  • Industrial embedded systems — Compact DDR memory for industrial electronics operating from –40 °C to +85 °C where deterministic DDR timing is required.
  • Compact system memory expansion — Space-constrained boards needing a 60-ball FBGA 256 Mbit DDR device with byte-oriented DQS and data masking.

Unique Advantages

  • AEC-Q100 qualification: Provides documented qualification for designs that require automotive-grade components.
  • DDR source-synchronous capture: DQS per byte and DLL alignment simplify timing closure for high-speed reads and writes.
  • Compact FBGA footprint: 60-ball (8 mm × 12.5 mm) package reduces board area for space-constrained applications.
  • Flexible timing and burst control: Programmable burst lengths (2/4/8) and auto precharge support adapt to varied memory access patterns.
  • Wide operating voltage range: 2.3 V–2.7 V supply supports standard 2.5 V DDR I/O requirements while matching device timing specifications.
  • Production readiness: Automotive-focused documentation items such as PPAP submission and 8D response are available as noted in product documentation.

Why Choose MT46V16M16CY-5B AIT:M TR?

This MT46V16M16CY-5B AIT:M TR device combines a compact 60-ball FBGA package with a 256 Mbit DDR SDRAM architecture designed for synchronous, source-synchronous data capture and predictable timing. Its organization (16M × 16), four internal banks, and DDR features such as DLL alignment, programmable burst lengths and dual-byte DQS support make it suitable for embedded systems requiring compact automotive-grade memory.

With AEC-Q100 qualification, an extended operating temperature range (–40 °C to +85 °C), and automotive-oriented documentation, this device targets engineering teams designing robust, qualified systems that need verified DDR performance in a small solder-down package.

Request a quote or contact sales to obtain pricing, lead times and availability for the MT46V16M16CY-5B AIT:M TR.

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