MT46V16M16CY-5B AIT:M TR
| Part Description |
IC DRAM 256MBIT PARALLEL 60FBGA |
|---|---|
| Quantity | 530 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 60-FBGA (8x12.5) | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 700 ps | Grade | Automotive | ||
| Clock Frequency | 200 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 60-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q100 | ECCN | EAR99 | HTS Code | 8542.32.0036 |
Overview of MT46V16M16CY-5B AIT:M TR – IC DRAM 256MBIT PARALLEL 60FBGA
The MT46V16M16CY-5B AIT:M TR is a 256 Mbit DDR SDRAM device organized as 16M × 16 with a parallel memory interface in a 60-ball FBGA package. It implements an internal, pipelined double-data-rate architecture with source-synchronous data capture and differential clock inputs for synchronous DDR operation.
Designed for designs requiring compact, qualified DDR memory, the device provides automotive-grade qualification and industrial temperature range support, offering deterministic timing features and standard DDR functionality such as programmable burst lengths, auto refresh and self refresh (variant dependent).
Key Features
- Core Architecture Internal pipelined DDR architecture enabling two data accesses per clock cycle and a DLL to align DQ and DQS transitions with the clock.
- Memory Organization 256 Mbit capacity arranged as 16M × 16 with four internal banks for concurrent operation.
- Performance & Timing 200 MHz clock frequency (–5B grade) with an access window and data-out timing appropriate for CL = 3 operation; access time listed as 700 ps and write cycle time (word page) of 15 ns.
- Data Timing and I/O Bidirectional data strobe (DQS) transmitted/received with data for source-synchronous capture (x16 has two DQS signals, one per byte). Differential clock inputs (CK/CK#) and data mask (DM) support (x16 has two DMs, one per byte).
- Programmable Operation Programmable burst lengths of 2, 4, or 8 and support for concurrent auto precharge and auto refresh (8192-cycle refresh counts as specified).
- Power Supply voltage range 2.3 V to 2.7 V; I/O signaling compatible with 2.5 V I/O levels as documented.
- Package & Mounting 60-ball thin FBGA package (8 mm × 12.5 mm) for compact board footprint and surface-mount assembly.
- Temperature & Qualification Operating temperature range –40 °C to +85 °C (TA) with AEC-Q100 qualification and automotive-oriented documentation (PPAP submission and 8D response noted).
Typical Applications
- Automotive control modules — Automotive-qualified DDR memory for embedded controllers and modules requiring AEC-Q100 qualification and extended temperature range.
- Industrial embedded systems — Compact DDR memory for industrial electronics operating from –40 °C to +85 °C where deterministic DDR timing is required.
- Compact system memory expansion — Space-constrained boards needing a 60-ball FBGA 256 Mbit DDR device with byte-oriented DQS and data masking.
Unique Advantages
- AEC-Q100 qualification: Provides documented qualification for designs that require automotive-grade components.
- DDR source-synchronous capture: DQS per byte and DLL alignment simplify timing closure for high-speed reads and writes.
- Compact FBGA footprint: 60-ball (8 mm × 12.5 mm) package reduces board area for space-constrained applications.
- Flexible timing and burst control: Programmable burst lengths (2/4/8) and auto precharge support adapt to varied memory access patterns.
- Wide operating voltage range: 2.3 V–2.7 V supply supports standard 2.5 V DDR I/O requirements while matching device timing specifications.
- Production readiness: Automotive-focused documentation items such as PPAP submission and 8D response are available as noted in product documentation.
Why Choose MT46V16M16CY-5B AIT:M TR?
This MT46V16M16CY-5B AIT:M TR device combines a compact 60-ball FBGA package with a 256 Mbit DDR SDRAM architecture designed for synchronous, source-synchronous data capture and predictable timing. Its organization (16M × 16), four internal banks, and DDR features such as DLL alignment, programmable burst lengths and dual-byte DQS support make it suitable for embedded systems requiring compact automotive-grade memory.
With AEC-Q100 qualification, an extended operating temperature range (–40 °C to +85 °C), and automotive-oriented documentation, this device targets engineering teams designing robust, qualified systems that need verified DDR performance in a small solder-down package.
Request a quote or contact sales to obtain pricing, lead times and availability for the MT46V16M16CY-5B AIT:M TR.