MT46V16M16CY-5B:K TR
| Part Description |
IC DRAM 256MBIT PARALLEL 60FBGA |
|---|---|
| Quantity | 636 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 60-FBGA (8x12.5) | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 700 ps | Grade | Commercial | ||
| Clock Frequency | 200 MHz | Voltage | 2.5V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 60-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT46V16M16CY-5B:K TR – IC DRAM 256MBIT PARALLEL 60FBGA
The MT46V16M16CY-5B:K TR is a 256 Mbit volatile DDR SDRAM device organized as 16M × 16 with a parallel memory interface. It delivers DDR-class operation with a 200 MHz clock frequency and 700 ps access time in a compact 60-TFBGA package.
Designed for systems requiring moderate-density, parallel DDR memory, this device is suited to applications that need predictable timing, a 2.5 V–2.7 V supply range, and board-level integration in a 60-FBGA (8 × 12.5 mm) footprint.
Key Features
- Core & Memory Technology
SDRAM – DDR architecture providing volatile DRAM storage with a total capacity of 256 Mbit organized as 16M × 16. - Performance & Timing
Rated clock frequency of 200 MHz with an access time of 700 ps and a write cycle time (word page) of 15 ns to support time-sensitive memory operations. - Power
Operates from a 2.5 V to 2.7 V supply range, enabling compatibility with systems designed for standard DDR voltage rails. - Interface & Organization
Parallel 16-bit memory interface for direct bus integration in systems that require parallel DDR memory mapping. - Package & Mounting
60-TFBGA package (supplier device package: 60-FBGA, 8 × 12.5 mm) for surface-mount mounting and compact board-level integration. - Operating Range
Specified for an ambient operating temperature range of 0°C to 70°C (TA), appropriate for commercial-temperature applications.
Typical Applications
- Consumer electronics
Provides parallel DDR memory capacity for consumer devices that require 256 Mbit storage with compact BGA packaging. - Embedded systems
Used as onboard DDR SDRAM for embedded modules and controllers that need a 16-bit parallel memory interface and defined timing characteristics. - Prototyping and development platforms
Suitable for evaluation boards and prototypes that require a standard DDR memory device with specified clock and access timing. - Networking and communications modules
Can serve as working memory in communication modules where parallel DDR memory and 200 MHz clocking support system requirements.
Unique Advantages
- DDR performance at 200 MHz: Enables predictable timing and throughput consistent with the part’s DDR SDRAM specification and 700 ps access time.
- Compact FBGA footprint: 60-TFBGA / 60-FBGA (8 × 12.5 mm) package minimizes board area while supporting surface-mount assembly.
- Defined parallel interface: 16-bit parallel organization (16M × 16) simplifies integration into designs that require a parallel DDR memory bus.
- Commercial temperature rating: Specified operation from 0°C to 70°C for deployments in standard commercial environments.
- Standard DDR voltage range: 2.5 V–2.7 V supply compatibility with common DDR power rails.
Why Choose IC DRAM 256MBIT PARALLEL 60FBGA?
The MT46V16M16CY-5B:K TR positions itself as a straightforward, specification-driven DDR SDRAM option for designs that require 256 Mbit of volatile memory in a 16-bit parallel organization. Its combination of 200 MHz clocking, 700 ps access time, and a compact 60-FBGA package supports board-level designs where predictable timing and space-efficient mounting are priorities.
Manufactured by Micron Technology Inc., this device is appropriate for developers and procurement teams seeking a defined commercial-temperature DDR memory component for consumer, embedded, and communications applications where the listed electrical, timing, and packaging specifications match system requirements.
Request a quote or submit a quote inquiry to obtain pricing and availability for the MT46V16M16CY-5B:K TR and to discuss order quantities or lead times.