MT46V16M16CY-5B XIT:M TR
| Part Description |
IC DRAM 256MBIT PARALLEL 60FBGA |
|---|---|
| Quantity | 262 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 60-FBGA (8x12.5) | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 700 ps | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.5V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 60-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0036 |
Overview of MT46V16M16CY-5B XIT:M TR – IC DRAM 256MBIT PARALLEL 60FBGA
The MT46V16M16CY-5B XIT:M TR is a 256 Mbit DDR SDRAM device organized as 16M × 16 with a parallel memory interface. It implements DDR SDRAM technology and is supplied in a 60-ball FBGA package.
With a 200 MHz clock rating, 700 ps access time and a supply voltage range of 2.5 V to 2.7 V, this device targets designs that require compact, fast volatile memory in a small BGA footprint and an extended operating temperature range.
Key Features
- Memory Core: 256 Mbit capacity organized as 16M × 16, providing a parallel 16-bit data path.
- Technology: DDR SDRAM architecture designed for double-data-rate operation with a specified 200 MHz clock frequency.
- Performance: 700 ps access time and a write cycle time (word/page) of 15 ns for predictable memory timing.
- Power Supply: Operates from a 2.5 V to 2.7 V supply range.
- Package: 60-ball TFBGA / 60-FBGA (8 × 12.5) package for compact board-level integration.
- Operating Temperature: Specified for −40°C to 85°C (TA), supporting a wide ambient temperature range.
- Interface: Parallel memory interface suitable for designs using DDR parallel signaling.
Typical Applications
- Parallel DDR memory subsystems — Use as on-board 256 Mbit DDR SDRAM in systems that require a 16-bit parallel memory device.
- Buffering and temporary storage — Provide volatile data storage with 200 MHz clock performance and 15 ns write cycle timing.
- Compact board designs — Small 60-FBGA package supports space-constrained PCB layouts while offering standard DDR functionality.
Unique Advantages
- Defined DDR operation: 200 MHz clock frequency and DDR SDRAM technology deliver predictable double-data-rate behavior tied to the specified timing metrics.
- Clear timing specifications: 700 ps access time and 15 ns write cycle time provide engineers with concrete parameters for system timing budgets.
- Wide temperature capability: −40°C to 85°C (TA) rating supports deployment across a broad range of ambient conditions.
- Compact BGA footprint: 60-TFBGA / 60-FBGA (8 × 12.5) package enables high-density board integration.
- Standard supply range: 2.5 V–2.7 V operation aligns with typical DDR voltage domains for compatible system power design.
Why Choose IC DRAM 256MBIT PARALLEL 60FBGA?
The MT46V16M16CY-5B XIT:M TR positions itself as a straightforward, specification-driven DDR SDRAM device for designs needing a 256 Mbit parallel memory element with defined timing and voltage requirements. Its 16M × 16 organization, 200 MHz clock rating and compact 60-FBGA package make it suitable for integration where PCB space and predictable DDR timing are priorities.
This device is appropriate for engineers and procurement teams seeking a documented DDR DRAM component with explicit access time, write cycle timing, supply voltage range and ambient temperature specifications to support robust system design and qualification activities.
Request a quote or submit an inquiry to receive pricing and availability information for the MT46V16M16CY-5B XIT:M TR.