MT46V16M16FG-75:F

IC DRAM 256MBIT PARALLEL 60FBGA
Part Description

IC DRAM 256MBIT PARALLEL 60FBGA

Quantity 261 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package60-FBGA (8x14)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size256 MbitAccess Time750 psGradeCommercial
Clock Frequency133 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging60-FBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level2 (1 Year)RoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V16M16FG-75:F – IC DRAM 256MBIT PARALLEL 60FBGA

The MT46V16M16FG-75:F is a 256 Mbit DDR SDRAM device organized as 16M × 16, offered in a 60-ball FBGA (8 × 14 mm) package. It implements a double-data-rate architecture with internal pipelining and a DLL, delivering two data accesses per clock cycle.

Designed for systems that require parallel DDR memory, the device provides source-synchronous data capture, programmable burst lengths and four internal banks, combining predictable timing behavior with a compact FBGA footprint.

Key Features

  • Core DDR Architecture Internal, pipelined double-data-rate architecture with a DLL to align DQ and DQS transitions and four internal banks for concurrent operation.
  • Memory Organization 256 Mbit capacity organized as 16M × 16 with data mask (DM) support; x16 configuration includes two DMs and two DQS signals (one per byte).
  • Source‑Synchronous Interface Bidirectional data strobe (DQS) transmitted/received with data for source-synchronous capture; DQS edge-aligned for READs and center-aligned for WRITEs.
  • Programmable Burst and Refresh Programmable burst lengths of 2, 4, or 8, with auto-refresh and self-refresh options documented in the device specification.
  • Timing and Performance Clock frequency 133 MHz (speed grade -75) with an access-time parameter consistent with DDR timing; write cycle (word/page) listed at 15 ns.
  • Power Supply voltage range 2.3 V to 2.7 V (VDD/VDDQ documented in the datasheet details for applicable speed grades).
  • Package and Temperature 60-ball FBGA package (8 mm × 14 mm) and a commercial operating temperature range of 0°C to +70°C (TA).

Typical Applications

  • Parallel DDR memory for embedded systems — Provides 256 Mbit of DDR SDRAM in a compact FBGA package for designs using parallel memory interfaces.
  • Board-level memory expansion — Useful where a 16-bit wide DDR memory element is required for system memory arrays or buffers.
  • High-speed data buffering — Source-synchronous DQS and programmable burst lengths enable predictable, high-rate data transfers in buffer applications.

Unique Advantages

  • Source-synchronous data capture: DQS transmitted/received with data supports accurate timing alignment for READ and WRITE operations.
  • Flexible burst operation: Programmable burst lengths (2, 4, 8) allow tuning for sequential access patterns and system timing.
  • Dual-byte support on x16: Two DQS and two DM signals (x16) provide byte-level control and masking for write operations.
  • Compact FBGA footprint: 60-ball FBGA (8×14 mm) package minimizes board area while maintaining DDR signal integrity considerations.
  • Commercial temperature rating: Rated for 0°C to +70°C for applications specified for commercial environments.
  • Documented DDR features: DLL alignment, four internal banks, auto-refresh and self-refresh options are specified in the device datasheet for reliable operation.

Why Choose MT46V16M16FG-75:F?

The MT46V16M16FG-75:F positions as a straightforward 256 Mbit DDR SDRAM solution where a 16-bit data width, source-synchronous capture and a compact 60-ball FBGA package are required. Its DDR architecture with an internal DLL and four-bank organization supports predictable, high-rate transfers while programmable burst lengths and data-mask features add flexibility for varied access patterns.

This device is suitable for commercial-temperature designs that need a documented DDR SDRAM component with explicit timing, power and package specifications. The datasheet provides detailed electrical and timing parameters to support system integration and BOM planning.

If you would like a formal quote or additional procurement information for the MT46V16M16FG-75:F, please submit a request or inquiry and include your required quantity and lead-time requirements.

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