MT46V32M16FN-6:C
| Part Description |
IC DRAM 512MBIT PAR 60FBGA |
|---|---|
| Quantity | 1,113 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 60-FBGA (10x12.5) | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 700 ps | Grade | Commercial | ||
| Clock Frequency | 167 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 60-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 5 (48 Hours) | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT46V32M16FN-6:C – IC DRAM 512MBIT PAR 60FBGA
The MT46V32M16FN-6:C is a 512 Mbit volatile DDR SDRAM offered by Micron Technology Inc., organized as 32M × 16 with a parallel memory interface. It delivers high-speed memory access with a 167 MHz clock frequency and a specified access time of 700 ps, targeted for systems requiring synchronous parallel DRAM.
This device is supplied in a 60-ball FBGA package (60-TFBGA / 60-FBGA, 10 × 12.5 mm), operates from 2.3 V to 2.7 V, and supports an operating ambient temperature range of 0°C to 70°C.
Key Features
- Memory Core 512 Mbit DDR SDRAM organized as 32M × 16, suitable for parallel memory architectures.
- Performance Synchronous DDR operation at a 167 MHz clock frequency with a specified access time of 700 ps and a write cycle time (word page) of 15 ns.
- Interface & Organization Parallel memory interface designed for conventional DRAM system integration and bus architectures.
- Power Operating supply voltage range from 2.3 V to 2.7 V, enabling compatibility with low-voltage system rails.
- Package & Mounting 60-ball TFBGA/FBGA package, supplier device package size 10 × 12.5 mm, intended for surface-mount assembly.
- Operating Conditions Ambient operating temperature range specified from 0°C to 70°C (TA).
Unique Advantages
- Compact FBGA footprint: 60-ball package with 10 × 12.5 mm supplier package dimensions simplifies board space planning for compact designs.
- High-speed access: 167 MHz clock and 700 ps access time provide deterministic read/write timing for synchronous parallel systems.
- Standard density and organization: 512 Mbit capacity in a 32M × 16 arrangement supports straightforward memory mapping and sizing.
- Low-voltage operation: 2.3 V to 2.7 V supply range aligns with low-voltage system domains for power-constrained designs.
- Defined timing for page writes: 15 ns write cycle time (word page) provides a clear timing parameter for system memory scheduling.
Why Choose IC DRAM 512MBIT PAR 60FBGA?
The MT46V32M16FN-6:C provides a balanced combination of capacity, timing, and packaging for designs that require a parallel DDR SDRAM solution. Its specified clock frequency, access time, and write-cycle timing give engineers concrete parameters for system timing and memory performance planning.
With a compact 60-FBGA package and a defined supply voltage and temperature range, this DRAM device is suited to applications where board space, predictable timing, and low-voltage compatibility are primary considerations. The Micron designation identifies manufacturer sourcing for supply-chain visibility.
Request a quote or contact sales to discuss availability, lead times, and pricing for the MT46V32M16FN-6:C.
