MT46V32M16TG-75Z:C TR

IC DRAM 512MBIT PARALLEL 66TSOP
Part Description

IC DRAM 512MBIT PARALLEL 66TSOP

Quantity 1,913 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOPMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time750 psGradeCommercial
Clock Frequency133 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level4 (72 Hours)RoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V32M16TG-75Z:C TR – 512Mbit DDR SDRAM, 66‑TSSOP

The MT46V32M16TG-75Z:C TR is a 512 Mbit volatile memory device implemented as DDR SDRAM with a 32M × 16 organization and a parallel memory interface. It is supplied in a 66‑TSSOP package and is specified for operation at a 133 MHz clock frequency.

Key device-level characteristics include a 750 ps access time, a 15 ns write cycle time (word page), and a nominal supply range of 2.3 V to 2.7 V. The device is specified for ambient operation from 0°C to 70°C (TA).

Key Features

  • Memory Architecture 512 Mbit capacity organized as 32M × 16 with a parallel DDR SDRAM architecture.
  • Performance and Timing 133 MHz clock frequency with 750 ps access time and a 15 ns write cycle time (word page) for deterministic timing characteristics.
  • Power Operates from a 2.3 V to 2.7 V supply range.
  • Package 66‑TSSOP (0.400", 10.16 mm width) surface-mount package for compact PCB implementation.
  • Memory Type Volatile DRAM (SDRAM - DDR) memory format with a parallel memory interface.
  • Operating Temperature Rated for ambient temperatures from 0°C to 70°C (TA).

Unique Advantages

  • High-density in a compact package: 512 Mbit capacity delivered in a 66‑TSSOP footprint allows space-efficient board layouts.
  • Parallel DDR interface at 133 MHz: Enables integration into designs that require synchronous parallel memory operation at the specified clock rate.
  • Deterministic timing: 750 ps access time and 15 ns write cycle time provide explicit timing parameters for system-level timing analysis.
  • Standard supply range: 2.3 V to 2.7 V supply requirement aligns with common DDR power rails for straightforward power design.
  • Commercial temperature rating: Specified 0°C to 70°C operating range for systems targeting standard ambient environments.

Why Choose IC DRAM 512MBIT PARALLEL 66TSOP?

The MT46V32M16TG-75Z:C TR positions as a straightforward 512 Mbit DDR SDRAM component intended for designs requiring a 32M × 16 parallel memory organization, explicit timing specifications, and a compact 66‑TSSOP package. Its defined access and write timings combined with a 133 MHz clock specification support predictable memory behavior in board-level integration.

This device is suitable for engineers and procurement teams specifying DDR SDRAM at the 512 Mbit density level with a 2.3 V–2.7 V supply and a commercial ambient operating range. Its package and electrical characteristics make it a direct choice where the listed specifications match system requirements.

Request a quote or contact sales to obtain pricing, availability, and ordering information for the MT46V32M16TG-75Z:C TR.

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