MT46V32M16TG-75Z:C

IC DRAM 512MBIT PARALLEL 66TSOP
Part Description

IC DRAM 512MBIT PARALLEL 66TSOP

Quantity 790 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOPMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time750 psGradeCommercial
Clock Frequency133 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level4 (72 Hours)RoHS ComplianceN/AREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V32M16TG-75Z:C – IC DRAM 512MBIT PARALLEL 66TSOP

The MT46V32M16TG-75Z:C is a 512 Mbit DDR SDRAM organized as 32M × 16 with a parallel memory interface. It is supplied in a 66-TSSOP (0.400", 10.16 mm width) package and operates from a 2.3 V to 2.7 V supply.

This device targets systems that require compact, parallel DDR memory with defined timing characteristics, offering a 133 MHz clock frequency, 750 ps access time, and a 0°C to 70°C ambient operating range for temperature-constrained designs.

Key Features

  • Memory Core and Interface DDR SDRAM architecture organized as 32M × 16 for a total of 512 Mbit with a parallel memory interface.
  • Performance 133 MHz clock frequency, 750 ps access time and a 15 ns write cycle time (word page) provide specified timing for system memory operations.
  • Voltage Operates from a 2.3 V to 2.7 V supply, matching low-voltage DDR system rails.
  • Package 66-TSSOP (0.400", 10.16 mm width) supplier device package suitable for space-constrained PCBs.
  • Memory Characteristics Volatile DRAM format with standard DDR timing parameters and parallel interface topology.
  • Operating Range Specified ambient temperature range of 0°C to 70°C (TA) for designs within commercial temperature limits.

Typical Applications

  • Embedded Systems Provides 512 Mbit of parallel DDR SDRAM for embedded controllers and modules requiring 32M × 16 memory organization and defined timing.
  • Consumer Electronics Suitable for consumer devices operating within a 0°C–70°C ambient range that require low-voltage (2.3 V–2.7 V) DDR memory in a compact 66-TSSOP footprint.
  • Industrial Control Fits industrial control modules that need a parallel DDR memory interface with 133 MHz clocking and 15 ns write cycle timing.

Unique Advantages

  • Compact 66-TSSOP Package: Small footprint (0.400", 10.16 mm width) reduces board area for space-constrained designs.
  • Defined DDR Performance: 133 MHz clock frequency, 750 ps access time and 15 ns write cycle time provide predictable timing for system integration.
  • Standard Parallel Interface: Parallel memory interface and 32M × 16 organization simplify integration into designs that use parallel DRAM topologies.
  • Low-Voltage Operation: 2.3 V–2.7 V supply range enables compatibility with low-voltage DDR power rails.
  • Commercial Temperature Range: 0°C–70°C operating range aligns with typical commercial application environments.

Why Choose MT46V32M16TG-75Z:C?

The MT46V32M16TG-75Z:C offers a compact, defined-capacity DDR SDRAM option with a 32M × 16 organization and parallel interface, delivering 512 Mbit of volatile memory in a 66-TSSOP package. Its specified timing (133 MHz clock, 750 ps access, 15 ns write cycle) and low-voltage operation (2.3 V–2.7 V) make it well suited for designs that require predictable DDR performance within a commercial temperature range.

Manufactured by Micron Technology Inc., this device is appropriate for designers and buyers seeking a standardized parallel DDR memory component for embedded, consumer, or industrial applications where package size, timing clarity, and voltage compatibility are primary selection criteria.

Request a quote or submit a pricing inquiry to obtain availability and volume pricing for the MT46V32M16TG-75Z:C.

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