MT46V32M8BG-5B:GTR

IC DRAM 256MBIT PARALLEL 60FBGA
Part Description

IC DRAM 256MBIT PARALLEL 60FBGA

Quantity 1,017 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package60-FBGA (8x14)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size256 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.5V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging60-FBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V32M8BG-5B:GTR – IC DRAM 256MBIT PARALLEL 60FBGA

The MT46V32M8BG-5B:GTR is a 256 Mbit volatile DDR SDRAM organized as 32M × 8 with a parallel memory interface. It implements a pipelined double-data-rate architecture with source-synchronous data capture and internal DLL to align signals, enabling two data transfers per clock cycle.

Designed for systems that require compact, board-mounted DDR memory, this device delivers 256 Mbit capacity in a 60-ball FBGA (8 × 14 mm) package and operates over a commercial temperature range of 0°C to 70°C.

Key Features

  • Core / Architecture  Internal pipelined DDR architecture with two data accesses per clock cycle and DLL alignment.
  • Memory Organization & Capacity  256 Mbit total capacity arranged as 32M × 8 with four internal banks for concurrent operation.
  • Performance / Timing  Rated for 200 MHz clock frequency (–5B timing) with an access time of 700 ps and write cycle time (word/page) of 15 ns.
  • Data Interface  Parallel DDR interface with bidirectional data strobe (DQS), data mask (DM), and differential clock inputs (CK/CK#) for source-synchronous capture.
  • Signal and Burst Control  Programmable burst lengths of 2, 4, or 8 and support for concurrent auto precharge options.
  • Power  Supply voltage range specified at 2.5 V to 2.7 V (VDD/VDDQ options noted in datasheet).
  • Refresh and Sleep  Supports auto refresh and self refresh (self refresh option noted in datasheet options).
  • Package & Mounting  60-ball FBGA package (8 mm × 14 mm) for board-level mounting; supplier device package listed as 60-FBGA (8×14).
  • Operating Temperature  Commercial temperature rating: 0°C to +70°C (TA).

Typical Applications

  • Parallel DDR memory subsystems  Use as on-board DDR SDRAM where a 256 Mbit, 32M × 8 parallel memory device is required.
  • Embedded systems with source-synchronous capture  Systems leveraging DQS and differential CK/CK# timing for reliable high-speed data transfers.
  • Compact board-level memory  Designs needing a small 60-ball FBGA footprint for space-constrained PCBs.

Unique Advantages

  • DDR two-transfers-per-cycle architecture: Enables higher effective data throughput by performing two data accesses per clock cycle.
  • Source-synchronous data capture (DQS): Bidirectional DQS paired with DLL alignment improves timing margin between DQ and clock edges.
  • Programmable burst lengths: Burst lengths of 2, 4, or 8 give flexibility for different access patterns and system requirements.
  • Compact FBGA package: 60-ball FBGA (8×14 mm) provides a compact mounting option for board-level memory integration.
  • Commercial temperature rating: Specified operation from 0°C to +70°C for typical commercial applications.
  • Standard 2.5 V I/O: Operates within a 2.5 V to 2.7 V supply range consistent with SSTL_2-compatible signalling noted in the datasheet.

Why Choose IC DRAM 256MBIT PARALLEL 60FBGA?

The MT46V32M8BG-5B:GTR positions itself as a straightforward 256 Mbit DDR SDRAM solution for designs that require a compact, parallel-interface memory device with source-synchronous data capture and programmable burst control. Its 32M × 8 organization, four internal banks, and DDR architecture provide the necessary building blocks for systems needing predictable DDR timing and board-level integration.

This device is suited to engineers specifying commercial-temperature DDR memory with a 60-ball FBGA package and 2.5 V-class I/O. The documented timing options, refresh modes, and package details give clear, verifiable integration parameters for system design and BOM planning.

Request a quote or submit an inquiry to receive pricing and lead-time information for the MT46V32M8BG-5B:GTR.

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