MT46V32M8BG-5B:GTR
| Part Description |
IC DRAM 256MBIT PARALLEL 60FBGA |
|---|---|
| Quantity | 1,017 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 60-FBGA (8x14) | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 700 ps | Grade | Commercial | ||
| Clock Frequency | 200 MHz | Voltage | 2.5V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 60-FBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT46V32M8BG-5B:GTR – IC DRAM 256MBIT PARALLEL 60FBGA
The MT46V32M8BG-5B:GTR is a 256 Mbit volatile DDR SDRAM organized as 32M × 8 with a parallel memory interface. It implements a pipelined double-data-rate architecture with source-synchronous data capture and internal DLL to align signals, enabling two data transfers per clock cycle.
Designed for systems that require compact, board-mounted DDR memory, this device delivers 256 Mbit capacity in a 60-ball FBGA (8 × 14 mm) package and operates over a commercial temperature range of 0°C to 70°C.
Key Features
- Core / Architecture Internal pipelined DDR architecture with two data accesses per clock cycle and DLL alignment.
- Memory Organization & Capacity 256 Mbit total capacity arranged as 32M × 8 with four internal banks for concurrent operation.
- Performance / Timing Rated for 200 MHz clock frequency (–5B timing) with an access time of 700 ps and write cycle time (word/page) of 15 ns.
- Data Interface Parallel DDR interface with bidirectional data strobe (DQS), data mask (DM), and differential clock inputs (CK/CK#) for source-synchronous capture.
- Signal and Burst Control Programmable burst lengths of 2, 4, or 8 and support for concurrent auto precharge options.
- Power Supply voltage range specified at 2.5 V to 2.7 V (VDD/VDDQ options noted in datasheet).
- Refresh and Sleep Supports auto refresh and self refresh (self refresh option noted in datasheet options).
- Package & Mounting 60-ball FBGA package (8 mm × 14 mm) for board-level mounting; supplier device package listed as 60-FBGA (8×14).
- Operating Temperature Commercial temperature rating: 0°C to +70°C (TA).
Typical Applications
- Parallel DDR memory subsystems Use as on-board DDR SDRAM where a 256 Mbit, 32M × 8 parallel memory device is required.
- Embedded systems with source-synchronous capture Systems leveraging DQS and differential CK/CK# timing for reliable high-speed data transfers.
- Compact board-level memory Designs needing a small 60-ball FBGA footprint for space-constrained PCBs.
Unique Advantages
- DDR two-transfers-per-cycle architecture: Enables higher effective data throughput by performing two data accesses per clock cycle.
- Source-synchronous data capture (DQS): Bidirectional DQS paired with DLL alignment improves timing margin between DQ and clock edges.
- Programmable burst lengths: Burst lengths of 2, 4, or 8 give flexibility for different access patterns and system requirements.
- Compact FBGA package: 60-ball FBGA (8×14 mm) provides a compact mounting option for board-level memory integration.
- Commercial temperature rating: Specified operation from 0°C to +70°C for typical commercial applications.
- Standard 2.5 V I/O: Operates within a 2.5 V to 2.7 V supply range consistent with SSTL_2-compatible signalling noted in the datasheet.
Why Choose IC DRAM 256MBIT PARALLEL 60FBGA?
The MT46V32M8BG-5B:GTR positions itself as a straightforward 256 Mbit DDR SDRAM solution for designs that require a compact, parallel-interface memory device with source-synchronous data capture and programmable burst control. Its 32M × 8 organization, four internal banks, and DDR architecture provide the necessary building blocks for systems needing predictable DDR timing and board-level integration.
This device is suited to engineers specifying commercial-temperature DDR memory with a 60-ball FBGA package and 2.5 V-class I/O. The documented timing options, refresh modes, and package details give clear, verifiable integration parameters for system design and BOM planning.
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