MT46V32M8P-6T:G TR
| Part Description |
IC DRAM 256MBIT PAR 66TSOP |
|---|---|
| Quantity | 1,243 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 700 ps | Grade | Commercial | ||
| Clock Frequency | 167 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT46V32M8P-6T:G TR – IC DRAM 256MBIT PAR 66TSOP
The MT46V32M8P-6T:G TR is a 256 Mbit DDR SDRAM organized as 32M × 8 with a parallel memory interface in a 66‑pin TSSOP package. It implements an internal pipelined Double-Data-Rate architecture with source-synchronous data capture and differential clock inputs, suited for board-level memory subsystems.
This device targets applications that require compact, commercial-temperature (0°C to 70°C) DDR memory with a 2.3 V–2.7 V supply window, supporting double transfers per clock and programmable burst lengths for flexible data throughput.
Key Features
- Core / Architecture Internal pipelined DDR architecture providing two data accesses per clock cycle and a DLL to align DQ/DQS transitions with CK.
- Memory Organization 256 Mbit capacity arranged as 32M × 8 with four internal banks for concurrent operation.
- Performance & Timing Clock support to 167 MHz (speed grade -6T), access time of 700 ps, and programmable burst lengths of 2, 4, or 8. Write cycle time (word page) is 15 ns.
- Data Interface & Signaling Parallel memory interface with bidirectional data strobe (DQS) transmitted/received with data, differential clock inputs (CK/CK#), and 2.5 V I/O (SSTL_2‑compatible).
- Power Operates from VDD = 2.3 V to 2.7 V (documented as 2.5 V ±0.2 V), with corresponding VDDQ options consistent with DDR signaling.
- Refresh & Self-Refresh Supports auto refresh (8K cycles) and self refresh (note: self refresh not available on AT device variants as documented).
- Package & Temperature 66‑pin TSSOP (0.400", 10.16 mm width) package; commercial operating ambient temperature range 0°C to 70°C.
Typical Applications
- Embedded memory subsystems — Use as on-board 256 Mbit DDR SDRAM where a 32M × 8 organization and parallel DDR interface are required.
- Board-level DDR memory — Suitable for systems requiring a 66‑pin TSSOP packaged DDR device with 2.3 V–2.7 V supply and up to 167 MHz clock operation.
- Commercial-temperature designs — Applicable for designs operating within the 0°C to 70°C ambient range.
Unique Advantages
- DDR throughput at 167 MHz (‑6T grade): Supports double-data-rate transfers at the documented 167 MHz clock rate for the -6T timing grade.
- Source-synchronous data capture (DQS): Bidirectional DQS transmitted/received with data simplifies timing alignment for read and write operations.
- Four internal banks and programmable bursts: Internal bank architecture plus BL = 2, 4, or 8 provides flexible burst behavior and concurrent operation.
- Standard SSTL_2-compatible I/O: 2.5 V I/O signaling for compatibility with typical DDR board interfaces.
- Compact 66‑TSSOP package: 66‑pin TSOP (0.400", 10.16 mm width) enables board-level integration where this package format is required.
- Commercial temperature rating: Rated for 0°C to 70°C ambient operation to match commercial-grade system requirements.
Why Choose MT46V32M8P-6T:G TR?
The MT46V32M8P-6T:G TR combines a 256 Mbit DDR SDRAM organization with source-synchronous DQS, differential clocking, and a 66‑pin TSSOP package to provide a compact, board-level DDR memory solution. Its documented timing grade and 2.3 V–2.7 V supply range suit designs that require defined DDR performance at commercial operating temperatures.
This device is appropriate for designers specifying a 32M × 8 DDR memory in a 66‑TSSOP form factor who need programmable burst length, four-bank concurrency, and standard SSTL_2‑compatible I/O. The documented feature set supports predictable integration and timing behavior for memory subsystems.
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