MT46V32M8P-6T:G TR

IC DRAM 256MBIT PAR 66TSOP
Part Description

IC DRAM 256MBIT PAR 66TSOP

Quantity 1,243 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOPMemory FormatDRAMTechnologySDRAM - DDR
Memory Size256 MbitAccess Time700 psGradeCommercial
Clock Frequency167 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V32M8P-6T:G TR – IC DRAM 256MBIT PAR 66TSOP

The MT46V32M8P-6T:G TR is a 256 Mbit DDR SDRAM organized as 32M × 8 with a parallel memory interface in a 66‑pin TSSOP package. It implements an internal pipelined Double-Data-Rate architecture with source-synchronous data capture and differential clock inputs, suited for board-level memory subsystems.

This device targets applications that require compact, commercial-temperature (0°C to 70°C) DDR memory with a 2.3 V–2.7 V supply window, supporting double transfers per clock and programmable burst lengths for flexible data throughput.

Key Features

  • Core / Architecture Internal pipelined DDR architecture providing two data accesses per clock cycle and a DLL to align DQ/DQS transitions with CK.
  • Memory Organization 256 Mbit capacity arranged as 32M × 8 with four internal banks for concurrent operation.
  • Performance & Timing Clock support to 167 MHz (speed grade -6T), access time of 700 ps, and programmable burst lengths of 2, 4, or 8. Write cycle time (word page) is 15 ns.
  • Data Interface & Signaling Parallel memory interface with bidirectional data strobe (DQS) transmitted/received with data, differential clock inputs (CK/CK#), and 2.5 V I/O (SSTL_2‑compatible).
  • Power Operates from VDD = 2.3 V to 2.7 V (documented as 2.5 V ±0.2 V), with corresponding VDDQ options consistent with DDR signaling.
  • Refresh & Self-Refresh Supports auto refresh (8K cycles) and self refresh (note: self refresh not available on AT device variants as documented).
  • Package & Temperature 66‑pin TSSOP (0.400", 10.16 mm width) package; commercial operating ambient temperature range 0°C to 70°C.

Typical Applications

  • Embedded memory subsystems — Use as on-board 256 Mbit DDR SDRAM where a 32M × 8 organization and parallel DDR interface are required.
  • Board-level DDR memory — Suitable for systems requiring a 66‑pin TSSOP packaged DDR device with 2.3 V–2.7 V supply and up to 167 MHz clock operation.
  • Commercial-temperature designs — Applicable for designs operating within the 0°C to 70°C ambient range.

Unique Advantages

  • DDR throughput at 167 MHz (‑6T grade): Supports double-data-rate transfers at the documented 167 MHz clock rate for the -6T timing grade.
  • Source-synchronous data capture (DQS): Bidirectional DQS transmitted/received with data simplifies timing alignment for read and write operations.
  • Four internal banks and programmable bursts: Internal bank architecture plus BL = 2, 4, or 8 provides flexible burst behavior and concurrent operation.
  • Standard SSTL_2-compatible I/O: 2.5 V I/O signaling for compatibility with typical DDR board interfaces.
  • Compact 66‑TSSOP package: 66‑pin TSOP (0.400", 10.16 mm width) enables board-level integration where this package format is required.
  • Commercial temperature rating: Rated for 0°C to 70°C ambient operation to match commercial-grade system requirements.

Why Choose MT46V32M8P-6T:G TR?

The MT46V32M8P-6T:G TR combines a 256 Mbit DDR SDRAM organization with source-synchronous DQS, differential clocking, and a 66‑pin TSSOP package to provide a compact, board-level DDR memory solution. Its documented timing grade and 2.3 V–2.7 V supply range suit designs that require defined DDR performance at commercial operating temperatures.

This device is appropriate for designers specifying a 32M × 8 DDR memory in a 66‑TSSOP form factor who need programmable burst length, four-bank concurrency, and standard SSTL_2‑compatible I/O. The documented feature set supports predictable integration and timing behavior for memory subsystems.

Request a quote or submit an inquiry for MT46V32M8P-6T:G TR to receive availability and pricing information for your design evaluation.

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