MT46V64M8CV-5B:J TR
| Part Description |
IC DRAM 512MBIT PARALLEL 60FBGA |
|---|---|
| Quantity | 331 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 60-FBGA (8x12.5) | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 700 ps | Grade | Commercial | ||
| Clock Frequency | 200 MHz | Voltage | 2.5V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 60-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT46V64M8CV-5B:J TR – IC DRAM 512MBIT PARALLEL 60FBGA
The MT46V64M8CV-5B:J TR is a 512 Mbit DDR SDRAM organized as 64M × 8, implemented in a 60-ball FBGA package. It provides a parallel DDR memory interface with a 200 MHz clock frequency and timing characteristics suitable for board-level external memory in systems requiring volatile DRAM storage.
Key electrical and mechanical attributes include a 2.5 V–2.7 V supply range, access time of 700 ps, a write cycle time (word/page) of 15 ns, and an operating ambient temperature range of 0°C–70°C (TA).
Key Features
- Memory Core 512 Mbit total capacity organized as 64M × 8 for byte-wide data paths and predictable addressing.
- DDR SDRAM Technology SDRAM - DDR architecture with a 200 MHz clock frequency and an access time of 700 ps for timing-sensitive designs.
- Interface Parallel memory interface suitable for systems that employ parallel DDR memory architectures.
- Power Operates from a 2.5 V to 2.7 V supply, enabling compatibility with systems using that DDR supply window.
- Timing Write cycle time (word/page) specified at 15 ns to support system memory timing requirements.
- Package 60-ball FBGA package (60-VFBGA / 60-FBGA, 8 × 12.5 mm) for compact board-level mounting.
- Operating Temperature Rated for ambient operation from 0°C to 70°C (TA), matching commercial temperature applications.
Typical Applications
- Parallel DDR memory subsystems Board-level external DRAM for systems that require a parallel DDR interface and 512 Mbit capacity.
- Compact memory modules Small FBGA footprint enables integration in space-constrained PCBs where board-level DRAM is needed.
- System memory expansion Adds volatile DDR storage to designs that operate within a 2.5 V–2.7 V supply domain and 0°C–70°C ambient range.
Unique Advantages
- 512 Mbit density in a single device: Provides moderate capacity without multi-device memory arrays, simplifying BOM and layout.
- Defined DDR timing: 200 MHz clock frequency and 700 ps access time enable consistent timing analysis and integration.
- Compatible supply range: 2.5 V–2.7 V operation aligns with typical DDR supply rails used on many parallel-memory platforms.
- Compact FBGA package: 60-FBGA (8 × 12.5 mm) package supports dense PCB designs and surface-mount assembly.
- Specified write timing: 15 ns write cycle time (word/page) provides a clear parameter for system-level memory performance planning.
- Commercial temperature rating: 0°C–70°C (TA) operating range suited to standard commercial applications.
Why Choose MT46V64M8CV-5B:J TR?
The MT46V64M8CV-5B:J TR offers a straightforward DDR SDRAM building block for designs that require 512 Mbit of volatile memory in a compact 60-FBGA package. With a 64M × 8 organization, defined DDR timing (200 MHz clock, 700 ps access), and a 2.5 V–2.7 V supply range, it is positioned for systems that need predictable parallel DDR memory behavior and a small board footprint.
This device is appropriate for engineers and procurement teams specifying board-level DDR memory for commercial-temperature applications where capacity, clear timing parameters, and package density are primary selection criteria.
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