MT46V64M8P-5B AIT:J TR

IC DRAM 512MBIT PARALLEL 66TSOP
Part Description

IC DRAM 512MBIT PARALLEL 66TSOP

Quantity 216 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOPMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeAutomotive
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationAEC-Q100ECCNEAR99HTS Code8542.32.0036

Overview of MT46V64M8P-5B AIT:J TR – 512 Mbit DDR SDRAM, 66‑TSSOP

The MT46V64M8P-5B AIT:J TR is a 512 Mbit DDR SDRAM organized as 64M × 8 with a parallel memory interface. It implements an internal, pipelined double-data-rate (DDR) architecture for two data accesses per clock cycle and supports a 200 MHz clock rate for high-throughput parallel memory applications.

Targeted for automotive-grade systems, this device combines AEC‑Q100 qualification with a wide operating range and a compact 66‑TSSOP package, delivering verified reliability and a small footprint for constrained system designs that require DDR performance and automotive-grade qualification.

Key Features

  • DDR architecture Internal pipelined double-data-rate operation provides two data transfers per clock cycle for improved throughput over single-data-rate memories.
  • Memory organization & size 512 Mbit capacity organized as 64M × 8 with four internal banks to enable concurrent bank operation and flexible addressing.
  • Performance Supports a 200 MHz clock frequency and an access time of 700 ps; key timing includes a write cycle time (word page) of 15 ns.
  • Data strobes and timing Bidirectional data strobe (DQS) is transmitted/received with data for source‑synchronous capture; device includes an internal DLL to align DQ/DQS with CK.
  • Flexible burst and masking Programmable burst lengths (2, 4, or 8) and data mask (DM) support controlled write masking and transfer granularity.
  • Refresh and power options Auto refresh and self refresh options are supported; refresh timing variants include automotive timing options described in the device documentation.
  • Supply and I/O Operates from a 2.3 V to 2.7 V supply range suitable for 2.5 V I/O signaling environments.
  • Package 66‑pin TSSOP (0.400", 10.16 mm width) long‑lead TSOP option for improved reliability in board assembly and handling.
  • Qualification and temperature AEC‑Q100 qualified and specified for an operating ambient temperature range of −40 °C to +85 °C (TA).

Typical Applications

  • Automotive memory subsystems AEC‑Q100 qualification and −40 °C to +85 °C range make the device suitable for automotive electronic modules requiring DDR buffering or working memory.
  • High-speed parallel buffering 200 MHz DDR operation and 64M × 8 organization support high-throughput parallel interface buffering in embedded controllers and digital subsystems.
  • System-level data capture Source-synchronous DQS and programmable burst lengths enable reliable, deterministic data capture for timing-sensitive read/write operations.

Unique Advantages

  • Automotive qualification (AEC‑Q100): Provides documented qualification for use in automotive-rated designs and environments.
  • DDR throughput in compact package: Delivers double‑data‑rate performance in a 66‑TSSOP footprint to save PCB space without sacrificing speed.
  • Robust timing features: Internal DLL, bidirectional DQS, and programmable burst lengths help simplify timing closure and improve data integrity.
  • Wide supply tolerance: 2.3 V to 2.7 V supply range accommodates 2.5 V I/O systems and provides margin for system power variations.
  • Concurrent bank operation: Four internal banks allow overlapping operations for improved effective bandwidth in multi-transaction workloads.

Why Choose MT46V64M8P-5B AIT:J TR?

The MT46V64M8P-5B AIT:J TR combines DDR performance, automotive qualification, and a compact 66‑TSSOP package to address space‑constrained designs that require verified reliability and deterministic timing. Its DDR architecture, DQS support and internal DLL simplify high-speed interface timing while the 64M × 8 organization and four internal banks provide flexible memory management.

This device is well suited to engineers designing automotive or high-reliability embedded systems that need a 512 Mbit parallel DDR memory solution with defined operating temperature range and supplier documentation for system integration and qualification.

Request a quote or submit a parts inquiry to receive pricing, lead-time, and availability information for MT46V64M8P-5B AIT:J TR. Provide your quantity and delivery requirements to expedite the response.

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