MT46V64M8P-5B IT:J TR
| Part Description |
IC DRAM 512MBIT PARALLEL 66TSOP |
|---|---|
| Quantity | 662 Available (as of May 4, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 700 ps | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.5V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0036 |
Overview of MT46V64M8P-5B IT:J TR – IC DRAM 512Mbit Parallel DDR, 66-TSSOP
The MT46V64M8P-5B IT:J TR is a 512 Mbit DDR SDRAM organized as 64M × 8 with a parallel memory interface in a 66‑pin TSSOP package. It implements a double-data-rate architecture with source‑synchronous data strobe and internal DLL to support high-speed, board‑level memory designs.
Targeted at systems requiring compact, industrial‑temperature volatile memory, this device provides DDR performance at up to a 200 MHz clock rate (DDR400 timing grade) while operating across an extended temperature range suitable for industrial applications.
Key Features
- Core / DDR Architecture Internal pipelined DDR architecture enabling two data transfers per clock cycle; differential clock inputs (CK/CK#) and DLL for timing alignment.
- Memory Organization & Capacity 512 Mbit capacity organized as 64M × 8 with four internal banks to support concurrent bank operation.
- Performance & Timing Speed grade -5B supporting a 200 MHz clock rate (DDR400 timing), access window down to 700 ps and write cycle time (word page) of 15 ns.
- Data Path & Transfer Bidirectional data strobe (DQS) transmitted/received with data for source‑synchronous capture; data mask (DM) for write masking; programmable burst lengths of 2, 4, or 8.
- Power & I/O VDD / VDDQ supply options of +2.5 V ±0.2 V (family typical) with 2.5 V I/O compatible with SSTL_2 signaling.
- Refresh & Reliability Auto refresh and self refresh capability noted in the device family; standard 8192 refresh cycles for commercial and industrial parts.
- Package & Temperature Range 66‑pin TSSOP (0.400", 10.16 mm width) long‑lead TSOP option for improved reliability; industrial operating temperature −40 °C to +85 °C (TA).
Typical Applications
- Industrial embedded systems — Board‑level volatile memory for controllers and embedded platforms requiring extended temperature operation.
- Legacy/parallel DDR designs — Direct replacement or integration for systems using parallel DDR SDRAM in a TSSOP package.
- PCB memory expansion — Compact TSOP footprint for adding high‑speed DDR memory to compact or space‑constrained PCBs.
Unique Advantages
- DDR performance at DDR400 timing: The -5B speed grade supports a 200 MHz clock rate enabling two transfers per clock for higher throughput compared with single‑data‑rate parts.
- Source‑synchronous data capture: DQS transmitted/received with data and DLL alignment improves timing margin for read/write operations.
- Industrial temperature rating: Specified operation from −40 °C to +85 °C supports deployment in temperature‑challenged environments.
- Compact, board‑friendly package: 66‑TSSOP package offers a small footprint and long‑lead option for enhanced assembly reliability.
- Flexible timing and burst control: Programmable burst lengths (2, 4, 8) and four internal banks allow designers to tune performance for application access patterns.
Why Choose MT46V64M8P-5B IT:J TR?
This MT46V64M8P‑5B IT device positions itself as a compact, industrial‑temperature DDR SDRAM solution for designs that require parallel DDR memory with verified timing features such as DQS, DLL, and programmable burst lengths. Its 64M × 8 organization and 512 Mbit capacity provide a predictable memory footprint for board‑level memory expansion and embedded system integration.
Engineers seeking a TSSOP‑packaged DDR memory with industrial temperature capability and DDR400 timing options will find the MT46V64M8P‑5B IT suitable for robust, space‑constrained designs where standard 2.5 V DDR I/O and source‑synchronous operation are required.
If you need pricing, lead‑time or volume quote information for MT46V64M8P-5B IT:J TR, request a quote or submit an inquiry to receive a sales response.