MT46V64M8P-75:D
| Part Description |
IC DRAM 512MBIT PARALLEL 66TSOP |
|---|---|
| Quantity | 1,551 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 750 ps | Grade | Commercial | ||
| Clock Frequency | 133 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 4 (72 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT46V64M8P-75:D – IC DRAM 512MBIT PARALLEL 66TSOP
The MT46V64M8P-75:D is a 512 Mbit DRAM device implemented as DDR SDRAM with a parallel memory interface. It is organized as 64M × 8 and operates with a 133 MHz clock frequency.
Designed for board-level memory implementations, the device offers defined timing and electrical characteristics for designs that require a parallel DDR memory solution in a 66-TSSOP package.
Key Features
- Memory Core & Technology DDR SDRAM technology in a DRAM memory format; memory organization of 64M × 8 giving a total capacity of 512 Mbit.
- Performance & Timing Rated clock frequency of 133 MHz with an access time of 750 ps and a write cycle time (word page) of 15 ns.
- Power Supply voltage range specified from 2.3 V to 2.7 V.
- Package 66-TSSOP (0.400", 10.16 mm width) supplier device package for surface-mount board integration.
- Operating Conditions Commercial operating temperature range of 0°C to 70°C (TA).
- Interface & Mounting Parallel memory interface; device is volatile DRAM intended for board-mounted applications.
Typical Applications
- Embedded memory for parallel systems — Use as on-board DDR memory where a parallel DDR interface and 512 Mbit capacity are required.
- Board-level memory expansion — Integrate into PCB designs needing a 64M × 8 DRAM organization in a 66-TSSOP footprint.
- Commercial electronics — Suitable for designs operating in the 0°C to 70°C temperature range with a 2.3 V–2.7 V supply.
Unique Advantages
- Defined DDR SDRAM architecture: Provides standard DDR SDRAM behavior with a 64M × 8 organization for predictable memory mapping.
- Compact TSOP footprint: 66-TSSOP (0.400", 10.16 mm width) package supports surface-mount board layouts where space and package profile are considerations.
- Specified timing parameters: 133 MHz clock frequency, 750 ps access time, and 15 ns write cycle time give clear timing targets for system integration.
- Narrow supply range: 2.3 V–2.7 V supply voltage specification helps define power delivery and decoupling requirements in the system design.
- Commercial temperature support: Rated for 0°C to 70°C operation for designs targeting commercial temperature environments.
Why Choose MT46V64M8P-75:D?
The MT46V64M8P-75:D positions itself as a straightforward 512 Mbit DDR SDRAM component for designs requiring a parallel memory interface and clear electrical and timing specifications. Its 64M × 8 organization, 133 MHz clock rating, and defined access and cycle times make it suitable for board-level memory implementations where those exact parameters are required.
Manufactured in a 66-TSSOP package and operating within a 2.3 V–2.7 V supply range and 0°C–70°C temperature window, the device is appropriate for commercial electronic designs that need a compact, specified DRAM solution from an established memory supplier.
Request a quote or submit an inquiry to obtain pricing and availability information for the MT46V64M8P-75:D.