MT46V64M8T67A3WC1

IC DRAM 512MBIT PARALLEL
Part Description

IC DRAM 512MBIT PARALLEL

Quantity 1,157 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageDieMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackagingDie
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity LevelN/ARoHS ComplianceN/AREACH ComplianceREACH Unaffected
QualificationN/AECCNOBSOLETEHTS Code0000.00.0000

Overview of MT46V64M8T67A3WC1 – IC DRAM 512MBIT PARALLEL

The MT46V64M8T67A3WC1 is a 512 Mbit volatile DRAM device implemented as DDR SDRAM with a parallel memory interface. It is organized as 64M × 8 and delivered in a die package.

Targeted for designs that require parallel DDR memory, this device provides a defined write cycle time and a specified operating voltage and temperature range to support system-level integration and thermal requirements.

Key Features

  • Memory Type & Format 512 Mbit volatile memory in DRAM format using SDRAM - DDR technology.
  • Memory Organization Organized as 64M × 8 to simplify bus and data-path design for parallel interfaces.
  • Interface Parallel memory interface compatible with DDR SDRAM signaling.
  • Performance Write cycle time (word page) specified at 15 ns for predictable write timing.
  • Power Operates from a supply voltage range of 2.3 V – 2.7 V.
  • Package Supplied as a die, enabling die-level integration into custom packages or modules.
  • Temperature Range Rated for operation from -40°C to 85°C (TA), supporting extended temperature applications.

Typical Applications

  • Embedded memory expansion Use where a 512 Mbit volatile DDR memory is required for system buffering or working memory.
  • Systems with parallel DDR interfaces Intended for designs that employ parallel SDRAM - DDR signaling and require a 64M × 8 organization.
  • Temperature-sensitive deployments Suitable for applications requiring operation across -40°C to 85°C (TA).

Unique Advantages

  • DDR SDRAM architecture: Provides standard SDRAM - DDR technology in a 512 Mbit device for parallel memory needs.
  • Defined timing: A 15 ns write cycle time offers a clear timing parameter for system design and integration.
  • Die form factor: Delivered as a die to enable direct die-level integration into custom assemblies or multi-die modules.
  • Wide operating temperature: -40°C to 85°C (TA) rating supports deployments with extended temperature requirements.
  • Controlled supply range: Operation from 2.3 V – 2.7 V allows designers to align power-domain specifications with system requirements.

Why Choose MT46V64M8T67A3WC1?

The MT46V64M8T67A3WC1 positions itself as a straightforward 512 Mbit DDR SDRAM die for designs that require parallel DRAM memory with defined timing, voltage, and temperature characteristics. Its 64M × 8 organization and 15 ns write cycle time provide designers with specific, verifiable parameters to integrate into memory subsystems.

This device is suited to customers and designs that prefer die-level integration and need a DDR SDRAM solution with a clear supply-voltage window and extended ambient operating temperature. Its specification-focused attributes support predictable system behavior and ease of integration where those exact parameters are required.

Request a quote or contact sales to discuss availability, pricing, and delivery options for the MT46V64M8T67A3WC1.

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