MT46V64M8T67A3WC1
| Part Description |
IC DRAM 512MBIT PARALLEL |
|---|---|
| Quantity | 1,157 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | Die | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | Die | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | N/A | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | 0000.00.0000 |
Overview of MT46V64M8T67A3WC1 – IC DRAM 512MBIT PARALLEL
The MT46V64M8T67A3WC1 is a 512 Mbit volatile DRAM device implemented as DDR SDRAM with a parallel memory interface. It is organized as 64M × 8 and delivered in a die package.
Targeted for designs that require parallel DDR memory, this device provides a defined write cycle time and a specified operating voltage and temperature range to support system-level integration and thermal requirements.
Key Features
- Memory Type & Format 512 Mbit volatile memory in DRAM format using SDRAM - DDR technology.
- Memory Organization Organized as 64M × 8 to simplify bus and data-path design for parallel interfaces.
- Interface Parallel memory interface compatible with DDR SDRAM signaling.
- Performance Write cycle time (word page) specified at 15 ns for predictable write timing.
- Power Operates from a supply voltage range of 2.3 V – 2.7 V.
- Package Supplied as a die, enabling die-level integration into custom packages or modules.
- Temperature Range Rated for operation from -40°C to 85°C (TA), supporting extended temperature applications.
Typical Applications
- Embedded memory expansion Use where a 512 Mbit volatile DDR memory is required for system buffering or working memory.
- Systems with parallel DDR interfaces Intended for designs that employ parallel SDRAM - DDR signaling and require a 64M × 8 organization.
- Temperature-sensitive deployments Suitable for applications requiring operation across -40°C to 85°C (TA).
Unique Advantages
- DDR SDRAM architecture: Provides standard SDRAM - DDR technology in a 512 Mbit device for parallel memory needs.
- Defined timing: A 15 ns write cycle time offers a clear timing parameter for system design and integration.
- Die form factor: Delivered as a die to enable direct die-level integration into custom assemblies or multi-die modules.
- Wide operating temperature: -40°C to 85°C (TA) rating supports deployments with extended temperature requirements.
- Controlled supply range: Operation from 2.3 V – 2.7 V allows designers to align power-domain specifications with system requirements.
Why Choose MT46V64M8T67A3WC1?
The MT46V64M8T67A3WC1 positions itself as a straightforward 512 Mbit DDR SDRAM die for designs that require parallel DRAM memory with defined timing, voltage, and temperature characteristics. Its 64M × 8 organization and 15 ns write cycle time provide designers with specific, verifiable parameters to integrate into memory subsystems.
This device is suited to customers and designs that prefer die-level integration and need a DDR SDRAM solution with a clear supply-voltage window and extended ambient operating temperature. Its specification-focused attributes support predictable system behavior and ease of integration where those exact parameters are required.
Request a quote or contact sales to discuss availability, pricing, and delivery options for the MT46V64M8T67A3WC1.