MT46V64M8P-75 L:D
| Part Description |
IC DRAM 512MBIT PARALLEL 66TSOP |
|---|---|
| Quantity | 492 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 750 ps | Grade | Commercial | ||
| Clock Frequency | 133 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 4 (72 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT46V64M8P-75 L:D – IC DRAM 512MBIT PARALLEL 66TSOP
The MT46V64M8P-75 L:D is a 512 Mbit parallel DRAM device implemented as a 64M × 8 DDR SDRAM memory. It provides volatile storage with a parallel memory interface and is supplied in a 66‑TSSOP package.
With a 133 MHz clock frequency, 750 ps access time and a nominal supply range of 2.3 V to 2.7 V, this device is suitable for designs that require mid-density DDR parallel memory in a compact 66‑TSOP footprint and a commercial operating temperature range.
Key Features
- Core / Technology DDR SDRAM architecture providing volatile dynamic memory in a parallel interface format.
- Memory Organization 512 Mbit capacity arranged as 64M × 8, enabling byte-wide parallel access.
- Performance 133 MHz clock frequency with a 750 ps access time and a 15 ns write cycle time (word/page) for predictable timing in memory subsystems.
- Power Operates from 2.3 V to 2.7 V, supporting low-voltage board designs.
- Package 66‑TSSOP (0.400", 10.16 mm width) package case (supplier device package: 66‑TSOP) for surface-mount assembly.
- Operating Temperature Commercial range 0°C to 70°C (TA).
Typical Applications
- Parallel memory subsystems — Provides 64M × 8 parallel DDR storage where byte-wide DRAM is required.
- On-board buffer memory — 512 Mbit capacity and 133 MHz clocking suit buffer and temporary storage implementations.
- Compact PCB designs — 66‑TSSOP package enables integration of mid-density DRAM in space-constrained assemblies.
Unique Advantages
- Appropriate mid-density capacity: 512 Mbit (64M × 8) offers a balance between density and board-level integration for parallel memory needs.
- Deterministic timing characteristics: 750 ps access time and 15 ns write cycle time (word/page) provide measurable performance for system timing design.
- Low-voltage operation: 2.3 V to 2.7 V supply range supports lower-power system designs and compatibility with low-voltage logic domains.
- Compact surface-mount package: 66‑TSSOP (10.16 mm width) simplifies placement on dense PCBs while preserving necessary pin count for parallel interface.
- Commercial temperature rating: 0°C to 70°C (TA) is suitable for many standard electronic applications.
Why Choose MT46V64M8P-75 L:D?
The MT46V64M8P-75 L:D positions itself as a practical DDR SDRAM option when a 512 Mbit parallel memory with defined timing and low-voltage operation is required. Its 64M × 8 organization, 133 MHz clocking, and 66‑TSSOP package make it suitable for systems that need compact, byte-wide DRAM integration.
This device is well suited for engineers and procurement teams specifying mid-density parallel DRAM in commercial-temperature designs where predictable access times, a narrow supply voltage window, and a standardized surface-mount package are important for system integration and long-term board-level reliability.
Request a quote or submit an inquiry to receive pricing and availability details for the MT46V64M8P-75 L:D.