MT46V64M8P-75 L:D

IC DRAM 512MBIT PARALLEL 66TSOP
Part Description

IC DRAM 512MBIT PARALLEL 66TSOP

Quantity 492 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOPMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time750 psGradeCommercial
Clock Frequency133 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level4 (72 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V64M8P-75 L:D – IC DRAM 512MBIT PARALLEL 66TSOP

The MT46V64M8P-75 L:D is a 512 Mbit parallel DRAM device implemented as a 64M × 8 DDR SDRAM memory. It provides volatile storage with a parallel memory interface and is supplied in a 66‑TSSOP package.

With a 133 MHz clock frequency, 750 ps access time and a nominal supply range of 2.3 V to 2.7 V, this device is suitable for designs that require mid-density DDR parallel memory in a compact 66‑TSOP footprint and a commercial operating temperature range.

Key Features

  • Core / Technology DDR SDRAM architecture providing volatile dynamic memory in a parallel interface format.
  • Memory Organization 512 Mbit capacity arranged as 64M × 8, enabling byte-wide parallel access.
  • Performance 133 MHz clock frequency with a 750 ps access time and a 15 ns write cycle time (word/page) for predictable timing in memory subsystems.
  • Power Operates from 2.3 V to 2.7 V, supporting low-voltage board designs.
  • Package 66‑TSSOP (0.400", 10.16 mm width) package case (supplier device package: 66‑TSOP) for surface-mount assembly.
  • Operating Temperature Commercial range 0°C to 70°C (TA).

Typical Applications

  • Parallel memory subsystems — Provides 64M × 8 parallel DDR storage where byte-wide DRAM is required.
  • On-board buffer memory — 512 Mbit capacity and 133 MHz clocking suit buffer and temporary storage implementations.
  • Compact PCB designs — 66‑TSSOP package enables integration of mid-density DRAM in space-constrained assemblies.

Unique Advantages

  • Appropriate mid-density capacity: 512 Mbit (64M × 8) offers a balance between density and board-level integration for parallel memory needs.
  • Deterministic timing characteristics: 750 ps access time and 15 ns write cycle time (word/page) provide measurable performance for system timing design.
  • Low-voltage operation: 2.3 V to 2.7 V supply range supports lower-power system designs and compatibility with low-voltage logic domains.
  • Compact surface-mount package: 66‑TSSOP (10.16 mm width) simplifies placement on dense PCBs while preserving necessary pin count for parallel interface.
  • Commercial temperature rating: 0°C to 70°C (TA) is suitable for many standard electronic applications.

Why Choose MT46V64M8P-75 L:D?

The MT46V64M8P-75 L:D positions itself as a practical DDR SDRAM option when a 512 Mbit parallel memory with defined timing and low-voltage operation is required. Its 64M × 8 organization, 133 MHz clocking, and 66‑TSSOP package make it suitable for systems that need compact, byte-wide DRAM integration.

This device is well suited for engineers and procurement teams specifying mid-density parallel DRAM in commercial-temperature designs where predictable access times, a narrow supply voltage window, and a standardized surface-mount package are important for system integration and long-term board-level reliability.

Request a quote or submit an inquiry to receive pricing and availability details for the MT46V64M8P-75 L:D.

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