MT46V64M8P-75 IT:D

IC DRAM 512MBIT PARALLEL 66TSOP
Part Description

IC DRAM 512MBIT PARALLEL 66TSOP

Quantity 481 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOPMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time750 psGradeIndustrial
Clock Frequency133 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level4 (72 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V64M8P-75 IT:D – 512 Mbit Parallel DRAM, 66‑TSSOP

The MT46V64M8P-75 IT:D is a 512 Mbit volatile memory device implemented as DDR SDRAM with a 64M × 8 organization. It provides parallel memory interface operation with a 133 MHz clock frequency and timing characteristics suitable for systems requiring fast, byte-wide DRAM storage.

Offered in a 66‑TSSOP package and supporting a supply range of 2.3 V to 2.7 V and an operating temperature range of -40 °C to 85 °C, this device is intended for designs that require compact, mid-density volatile memory with defined electrical and timing specs.

Key Features

  • Core / Memory Architecture DDR SDRAM technology with a 64M × 8 memory organization delivering a total of 512 Mbit of volatile storage.
  • Performance 133 MHz clock frequency and an access time of 750 ps combined with a write cycle time (word page) of 15 ns for predictable timing behavior.
  • Interface Parallel memory interface designed for byte-wide DRAM operation and system memory expansion.
  • Power Operates from a 2.3 V to 2.7 V supply range to support low-voltage system designs.
  • Package 66‑TSSOP (0.400", 10.16 mm width) supplier device package for compact board-level footprint.
  • Operating Range Rated for ambient temperatures from -40 °C to 85 °C (TA) to cover a broad thermal envelope.

Typical Applications

  • System memory and buffering — Used as parallel DDR SDRAM for systems that require 512 Mbit of volatile storage and fast read/write cycles.
  • Embedded controllers — Provides byte-wide memory capacity in compact board footprints where a 66‑TSSOP package is required.
  • Industrial electronics — Supports designs needing operation across -40 °C to 85 °C with a defined low-voltage supply range.

Unique Advantages

  • High-density 512 Mbit capacity: 64M × 8 organization consolidates memory requirements into a single device.
  • Defined timing performance: 133 MHz clock and 750 ps access time with a 15 ns write cycle time (word page) for consistent system timing design.
  • Low-voltage operation: 2.3 V to 2.7 V supply range enables integration into low-voltage platforms.
  • Compact package: 66‑TSSOP footprint (10.16 mm width) minimizes board area for space-constrained designs.
  • Wide ambient temperature support: -40 °C to 85 °C rating extends usability across a broad thermal range.

Why Choose IC DRAM 512MBIT PARALLEL 66TSOP?

The IC DRAM 512MBIT PARALLEL 66TSOP (MT46V64M8P-75 IT:D) positions itself as a mid-density DDR SDRAM option that balances compact packaging, defined high-speed timing, and low-voltage operation. Its 64M × 8 organization and 512 Mbit capacity make it suitable for designs that need reliable, byte-wide volatile memory in a small form factor.

This device is appropriate for engineers and procurement teams specifying parallel DDR memory with explicit electrical and timing parameters, and for projects that require a consistent operating range from -40 °C to 85 °C. The combination of package, voltage range, and timing simplifies integration into systems where board space and predictable performance are priorities.

Request a quote or submit a pricing and availability inquiry to receive detailed purchasing information and lead-time options for the MT46V64M8P-75 IT:D.

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