MT46V64M8TG-6T L:F

IC DRAM 512MBIT PAR 66TSOP
Part Description

IC DRAM 512MBIT PAR 66TSOP

Quantity 212 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOPMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency167 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level4 (72 Hours)RoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V64M8TG-6T L:F – IC DRAM 512Mbit DDR SDRAM, 66-TSSOP

The MT46V64M8TG-6T L:F is a 512 Mbit volatile DDR SDRAM organized as 64M × 8 with a parallel memory interface in a 66-TSSOP package. It implements a double-data-rate architecture with internal pipelined operation and four internal banks to support two data transfers per clock cycle.

Designed for board-level memory integration, this device targets systems that require compact, parallel DDR memory with a 66-pin TSOP footprint, 2.3 V–2.7 V supply range, and a commercial operating temperature of 0 °C to 70 °C.

Key Features

  • Memory Architecture  Organized as 64M × 8 (512 Mbit) DDR SDRAM with four internal banks and programmable burst lengths of 2, 4, or 8.
  • DDR Performance  Internal pipelined DDR architecture delivering two data accesses per clock cycle; specified clock frequency up to 167 MHz for the -6T speed grade.
  • Timing and Access  Typical access characteristics include an access time of 700 ps and write cycle time (word page) of 15 ns; speed-grade timing data provided for CL and data-out windows in the datasheet.
  • Interface and Signaling  Parallel memory interface with bidirectional data strobe (DQS) transmitted/received with data, and differential clock inputs (CK/CK#) for source-synchronous capture.
  • Power  Operates from a 2.3 V to 2.7 V supply range (VDD/VDDQ); supports standard DDR 2.5 V I/O signaling as described in the device specification.
  • Package  66-TSSOP (0.400", 10.16 mm width) long-lead TSOP option for board-level assembly; supplier device package: 66-TSOP.
  • Reliability and Refresh  Supports auto refresh and 8K refresh cycle counts as specified; commercial temperature rating of 0 °C to +70 °C (TA).

Typical Applications

  • Board-level Memory Expansion  Compact 66-TSSOP DDR device for adding 512 Mbit of volatile parallel memory on logic boards or memory daughtercards.
  • Embedded Systems  Parallel DDR memory for embedded designs that require organized 64M × 8 storage and standard DDR signaling.
  • Legacy / Form-factor Specific Designs  Replacement or design-in option where a 66-pin TSOP footprint and DDR SDRAM interface are required.

Unique Advantages

  • Compact 66-TSSOP footprint: Enables dense board layouts and straightforward replacement in designs using a 66-pin TSOP package.
  • DDR source-synchronous capture: Bidirectional DQS with differential clock inputs and DLL alignment supports reliable data capture at double data rate timing.
  • Matched timing options: -6T speed grade supports 167 MHz operation with documented data-out windows and DQS–DQ skew parameters for predictable timing margins.
  • Flexible burst and refresh control: Programmable burst lengths (2/4/8) plus auto-refresh support simplify memory access patterns and system refresh management.
  • Industry-standard supply range: 2.3 V–2.7 V supply compatibility aligns with common DDR 2.5 V I/O domains for integration into existing power architectures.

Why Choose IC DRAM 512MBIT PAR 66TSOP?

The MT46V64M8TG-6T L:F provides a straightforward DDR SDRAM solution when 512 Mbit of organized parallel volatile memory is required in a compact 66-TSSOP package. Its documented timing (including access window and DQS/DQ characteristics), support for programmable burst lengths, and four internal banks make it suitable for systems that need deterministic DDR behavior and predictable integration.

This device is well suited to designers specifying a 66-pin TSOP footprint with a 2.3 V–2.7 V supply and a commercial temperature range. The combination of DDR source-synchronous features and clear speed-grade timing data supports reliable memory subsystem design and long-term maintainability.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the MT46V64M8TG-6T L:F.

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