MT46V64M8TG-6T L:F
| Part Description |
IC DRAM 512MBIT PAR 66TSOP |
|---|---|
| Quantity | 212 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 700 ps | Grade | Commercial | ||
| Clock Frequency | 167 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 4 (72 Hours) | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT46V64M8TG-6T L:F – IC DRAM 512Mbit DDR SDRAM, 66-TSSOP
The MT46V64M8TG-6T L:F is a 512 Mbit volatile DDR SDRAM organized as 64M × 8 with a parallel memory interface in a 66-TSSOP package. It implements a double-data-rate architecture with internal pipelined operation and four internal banks to support two data transfers per clock cycle.
Designed for board-level memory integration, this device targets systems that require compact, parallel DDR memory with a 66-pin TSOP footprint, 2.3 V–2.7 V supply range, and a commercial operating temperature of 0 °C to 70 °C.
Key Features
- Memory Architecture Organized as 64M × 8 (512 Mbit) DDR SDRAM with four internal banks and programmable burst lengths of 2, 4, or 8.
- DDR Performance Internal pipelined DDR architecture delivering two data accesses per clock cycle; specified clock frequency up to 167 MHz for the -6T speed grade.
- Timing and Access Typical access characteristics include an access time of 700 ps and write cycle time (word page) of 15 ns; speed-grade timing data provided for CL and data-out windows in the datasheet.
- Interface and Signaling Parallel memory interface with bidirectional data strobe (DQS) transmitted/received with data, and differential clock inputs (CK/CK#) for source-synchronous capture.
- Power Operates from a 2.3 V to 2.7 V supply range (VDD/VDDQ); supports standard DDR 2.5 V I/O signaling as described in the device specification.
- Package 66-TSSOP (0.400", 10.16 mm width) long-lead TSOP option for board-level assembly; supplier device package: 66-TSOP.
- Reliability and Refresh Supports auto refresh and 8K refresh cycle counts as specified; commercial temperature rating of 0 °C to +70 °C (TA).
Typical Applications
- Board-level Memory Expansion Compact 66-TSSOP DDR device for adding 512 Mbit of volatile parallel memory on logic boards or memory daughtercards.
- Embedded Systems Parallel DDR memory for embedded designs that require organized 64M × 8 storage and standard DDR signaling.
- Legacy / Form-factor Specific Designs Replacement or design-in option where a 66-pin TSOP footprint and DDR SDRAM interface are required.
Unique Advantages
- Compact 66-TSSOP footprint: Enables dense board layouts and straightforward replacement in designs using a 66-pin TSOP package.
- DDR source-synchronous capture: Bidirectional DQS with differential clock inputs and DLL alignment supports reliable data capture at double data rate timing.
- Matched timing options: -6T speed grade supports 167 MHz operation with documented data-out windows and DQS–DQ skew parameters for predictable timing margins.
- Flexible burst and refresh control: Programmable burst lengths (2/4/8) plus auto-refresh support simplify memory access patterns and system refresh management.
- Industry-standard supply range: 2.3 V–2.7 V supply compatibility aligns with common DDR 2.5 V I/O domains for integration into existing power architectures.
Why Choose IC DRAM 512MBIT PAR 66TSOP?
The MT46V64M8TG-6T L:F provides a straightforward DDR SDRAM solution when 512 Mbit of organized parallel volatile memory is required in a compact 66-TSSOP package. Its documented timing (including access window and DQS/DQ characteristics), support for programmable burst lengths, and four internal banks make it suitable for systems that need deterministic DDR behavior and predictable integration.
This device is well suited to designers specifying a 66-pin TSOP footprint with a 2.3 V–2.7 V supply and a commercial temperature range. The combination of DDR source-synchronous features and clear speed-grade timing data supports reliable memory subsystem design and long-term maintainability.
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