MT46V64M8TG-6T:D TR
| Part Description |
IC DRAM 512MBIT PAR 66TSOP |
|---|---|
| Quantity | 219 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 700 ps | Grade | Commercial | ||
| Clock Frequency | 167 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 4 (72 Hours) | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of MT46V64M8TG-6T:D TR – 512 Mbit DDR SDRAM, 66‑TSSOP
The MT46V64M8TG-6T:D TR is a 512 Mbit DDR SDRAM device organized as 64M × 8 with a parallel memory interface. It implements a DDR architecture with source-synchronous DQS and an internal DLL to support double-data-rate transfers for designs requiring higher effective data throughput.
Designed for commercial-temperature systems (0°C to 70°C) in a compact 66‑TSSOP package, the device targets applications that need a small-footprint, low‑voltage (2.3 V–2.7 V) DDR memory solution with programmable burst lengths and standard refresh support.
Key Features
- Core / Architecture Internal pipelined double-data-rate (DDR) architecture delivering two data accesses per clock cycle; includes a DLL and differential clock inputs (CK/CK#) for timing alignment.
- Memory Organization 512 Mbit capacity organized as 64M × 8 with four internal banks for concurrent operation.
- Interface and Data Handling Parallel DDR interface with bidirectional data strobe (DQS) transmitted/received with data, data mask (DM) support, and programmable burst lengths of 2, 4, or 8.
- Performance / Timing Rated for 167 MHz clock operation (speed grade -6T), with an access time of 700 ps and a write cycle time (word/page) of 15 ns; timing grade -6T supports CL = 2.5 operation.
- Power Low-voltage operation with VDD/VDDQ range of 2.3 V to 2.7 V (nominal 2.5 V ± tolerance per device grade).
- Refresh and Power Management Supports auto refresh and self refresh modes to maintain data during refresh cycles.
- Package & Temperature 66‑TSSOP (0.400", 10.16 mm width) package; commercial operating temperature range 0°C to 70°C.
Typical Applications
- Embedded memory expansion — System boards and modules that require a 512 Mbit parallel DDR SDRAM for program or data buffering.
- Compact consumer electronics — Small-footprint designs benefiting from the 66‑TSSOP package and low-voltage operation.
- Interface and buffering subsystems — Use as temporary storage or burst-buffer memory where programmable burst lengths and source‑synchronous DQS simplify timing capture.
Unique Advantages
- Double-data-rate throughput: Delivers two data accesses per clock cycle via DDR architecture, increasing effective bandwidth without changing clock rate.
- Source-synchronous data capture: Bidirectional DQS transmitted/received with data and DLL alignment improve read/write timing stability.
- Compact TSOP footprint: 66‑TSSOP package (0.400", 10.16 mm) enables space-constrained board layouts while providing standard TSOP reliability.
- Flexible timing options: Speed grade -6T supports 167 MHz (CL=2.5) operation and programmable burst lengths for adaptable system timing and access patterns.
- Low-voltage operation: 2.3 V–2.7 V supply range reduces I/O power envelope for systems designed around 2.5 V signaling.
Why Choose MT46V64M8TG-6T:D TR?
The MT46V64M8TG-6T:D TR provides a verified 512 Mbit DDR SDRAM solution that combines DDR throughput, source‑synchronous DQS, and a compact 66‑TSSOP package. Its 64M × 8 organization, four internal banks, and programmable burst lengths make it suitable for systems that require deterministic DDR behavior in a small footprint.
With 167 MHz rated operation, low-voltage supply range, and standard refresh/self‑refresh support, this device is appropriate for commercial-temperature designs that need reliable, board‑level DDR memory integration with clear timing and power characteristics.
Request a quote or submit an RFQ to inquire about availability, lead times, and ordering options for the MT46V64M8TG-6T:D TR.