MT46V64M8TG-6T:D TR

IC DRAM 512MBIT PAR 66TSOP
Part Description

IC DRAM 512MBIT PAR 66TSOP

Quantity 219 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOPMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency167 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level4 (72 Hours)RoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT46V64M8TG-6T:D TR – 512 Mbit DDR SDRAM, 66‑TSSOP

The MT46V64M8TG-6T:D TR is a 512 Mbit DDR SDRAM device organized as 64M × 8 with a parallel memory interface. It implements a DDR architecture with source-synchronous DQS and an internal DLL to support double-data-rate transfers for designs requiring higher effective data throughput.

Designed for commercial-temperature systems (0°C to 70°C) in a compact 66‑TSSOP package, the device targets applications that need a small-footprint, low‑voltage (2.3 V–2.7 V) DDR memory solution with programmable burst lengths and standard refresh support.

Key Features

  • Core / Architecture Internal pipelined double-data-rate (DDR) architecture delivering two data accesses per clock cycle; includes a DLL and differential clock inputs (CK/CK#) for timing alignment.
  • Memory Organization 512 Mbit capacity organized as 64M × 8 with four internal banks for concurrent operation.
  • Interface and Data Handling Parallel DDR interface with bidirectional data strobe (DQS) transmitted/received with data, data mask (DM) support, and programmable burst lengths of 2, 4, or 8.
  • Performance / Timing Rated for 167 MHz clock operation (speed grade -6T), with an access time of 700 ps and a write cycle time (word/page) of 15 ns; timing grade -6T supports CL = 2.5 operation.
  • Power Low-voltage operation with VDD/VDDQ range of 2.3 V to 2.7 V (nominal 2.5 V ± tolerance per device grade).
  • Refresh and Power Management Supports auto refresh and self refresh modes to maintain data during refresh cycles.
  • Package & Temperature 66‑TSSOP (0.400", 10.16 mm width) package; commercial operating temperature range 0°C to 70°C.

Typical Applications

  • Embedded memory expansion — System boards and modules that require a 512 Mbit parallel DDR SDRAM for program or data buffering.
  • Compact consumer electronics — Small-footprint designs benefiting from the 66‑TSSOP package and low-voltage operation.
  • Interface and buffering subsystems — Use as temporary storage or burst-buffer memory where programmable burst lengths and source‑synchronous DQS simplify timing capture.

Unique Advantages

  • Double-data-rate throughput: Delivers two data accesses per clock cycle via DDR architecture, increasing effective bandwidth without changing clock rate.
  • Source-synchronous data capture: Bidirectional DQS transmitted/received with data and DLL alignment improve read/write timing stability.
  • Compact TSOP footprint: 66‑TSSOP package (0.400", 10.16 mm) enables space-constrained board layouts while providing standard TSOP reliability.
  • Flexible timing options: Speed grade -6T supports 167 MHz (CL=2.5) operation and programmable burst lengths for adaptable system timing and access patterns.
  • Low-voltage operation: 2.3 V–2.7 V supply range reduces I/O power envelope for systems designed around 2.5 V signaling.

Why Choose MT46V64M8TG-6T:D TR?

The MT46V64M8TG-6T:D TR provides a verified 512 Mbit DDR SDRAM solution that combines DDR throughput, source‑synchronous DQS, and a compact 66‑TSSOP package. Its 64M × 8 organization, four internal banks, and programmable burst lengths make it suitable for systems that require deterministic DDR behavior in a small footprint.

With 167 MHz rated operation, low-voltage supply range, and standard refresh/self‑refresh support, this device is appropriate for commercial-temperature designs that need reliable, board‑level DDR memory integration with clear timing and power characteristics.

Request a quote or submit an RFQ to inquire about availability, lead times, and ordering options for the MT46V64M8TG-6T:D TR.

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