MT47H32M16HR-25E:G TR

The MT47H32M16HR-25E:G TR is a 512 Mbit volatile DRAM implemented as DDR2 SDRAM with a parallel memory interface. It is organized as 32M x 16 and packaged in an 84-TFBGA footprint for surface-mount board-level integration.

Designed for applications that require a compact, parallel DDR2 memory device, this part provides 400 MHz clock operation, a 400 ps access time, and a 1.7 V–1.9 V supply range to meet mid-range DDR2 performance and power requirements.

Key Features

• Memory Core DDR2 SDRAM technology in a 512 Mbit density organized as 32M x 16, implemented as DRAM (volatile).
• Interface Parallel memory interface suitable for designs that use parallel DDR2 memory topologies.
• Performance 400 MHz clock frequency with a 400 ps access time and a write cycle time (word page) of 15 ns to support DDR2 timing requirements.
• Power Operates from a 1.7 V to 1.9 V supply range.
• Package 84-TFBGA package (supplier device package: 84-FBGA, 8x12.5) for compact surface-mount applications.
• Operating Range Commercial temperature range rated at 0°C to 85°C (TC).

Typical Applications

• Parallel-memory systems — For designs requiring a 512 Mbit parallel DDR2 SDRAM organized as 32M x 16.
• High-frequency DDR2 modules — Suited to applications that use a 400 MHz DDR2 interface and require 400 ps access times.
• Board-level memory expansion — 84-TFBGA (84-FBGA, 8×12.5) package supports compact, surface-mounted memory integration.

Unique Advantages

• Compact BGA footprint: 84-TFBGA / 84-FBGA (8×12.5) package enables high-density placement on PCBs where board space is constrained.
• DDR2 timing capability: 400 MHz clock and 400 ps access time provide timing characteristics consistent with DDR2 system requirements.
• Convenient memory organization: 32M x 16 organization simplifies mapping for parallel memory interfaces.
• Low-voltage operation: 1.7 V–1.9 V supply range supports low-voltage DDR2 designs.
• Predictable cycle timing: 15 ns write cycle time (word page) provides a defined timing parameter for system design.
• Commercial temperature rating: 0°C–85°C (TC) suits typical commercial-grade deployments.

Why Choose MT47H32M16HR-25E:G TR?

The MT47H32M16HR-25E:G TR offers a straightforward DDR2 SDRAM option when a 512 Mbit parallel memory device is required. With a 32M x 16 organization, 400 MHz clock capability, and defined timing metrics, it fits designs that prioritize a compact BGA package and standard DDR2 electrical characteristics.

This part is appropriate for engineers and procurement teams specifying parallel DDR2 memory where predictable timing, low-voltage operation, and a compact 84-TFBGA footprint are key selection criteria.

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