MT47H64M8B6-3 IT:D TR

The MT47H64M8B6-3 IT:D TR is a 512 Mbit DDR2 SDRAM device organized as 64M × 8 with a parallel memory interface. Designed as a volatile DDR2 memory component, it targets embedded and industrial systems requiring standard DDR2 architecture and industrial temperature operation.

This device provides DDR2 architecture features such as a DLL, internal banks and selectable burst lengths to support common SDRAM use cases where deterministic, high-throughput volatile storage is required. Key value propositions include support for industrial temperature ranges, a compact 60-ball FBGA package, and JEDEC-compatible DDR2 signaling and timing options documented in the product datasheet.

Key Features

• Core / Architecture DDR2 SDRAM architecture with 4 internal banks and a 4n-bit prefetch design for standard DDR2 operation.
• Memory Organization & Capacity 512 Mbit total capacity organized as 64M × 8 bits, providing byte-wide data paths for parallel memory systems.
• Speed & Timing Clock frequency specified at 333 MHz with an access time of 450 ps and a write cycle time (word page) of 15 ns; supports programmable CAS latency and selectable burst lengths (4 or 8).
• Power & I/O VDD / VDDQ supply range 1.7 V to 1.9 V (JEDEC-standard 1.8 V I/O). On-die termination (ODT) and adjustable data-output drive strength are supported per the datasheet.
• System Features DLL for DQ/DQS alignment, optional differential data strobe (DQS/DQS#), duplicate output strobe (RDQS) option for x8, and standard refresh support (64 ms, 8,192-cycle refresh).
• Package 60-ball FBGA package (60-FBGA) in a compact ball-grid format suitable for surface-mount assembly.
• Temperature Range Industrial temperature option: −40°C to 95°C case temperature (IT option).
• Compliance RoHS compliant per the product datasheet.

Typical Applications

• Industrial Control Systems Provides volatile DDR2 storage for embedded controllers and data buffering where industrial temperature operation is required.
• Communications Equipment Useful for packet buffering and temporary data storage in parallel-memory architectures.
• Consumer/Embedded Devices Byte-wide DDR2 memory for general-purpose embedded DRAM needs in compact FBGA packages.

Unique Advantages

• Industrial Temperature Support: Rated for −40°C to 95°C case temperature (IT), enabling deployment in temperature-sensitive industrial environments.
• Compact FBGA Footprint: 60-ball FBGA package minimizes PCB area while supporting surface-mount assembly for space-constrained designs.
• Standard DDR2 Feature Set: Includes DLL, ODT, selectable burst lengths and programmable CAS latency to align with JEDEC DDR2 design practices.
• Low-Voltage Operation: Operates at 1.7 V–1.9 V supply range compatible with JEDEC 1.8 V I/O systems.
• Family Options & Flexibility: Part of a 512 Mb DDR2 family offering x4, x8 and x16 configurations and multiple FBGA package variants per the datasheet.

Why Choose MT47H64M8B6-3 IT:D TR?

The MT47H64M8B6-3 IT:D TR places DDR2 SDRAM functionality in a compact 60-FBGA package with industrial temperature grading and standard DDR2 system features. Its 64M × 8 organization, programmable timing options and on-die termination support make it suitable for embedded designs that require JEDEC-compatible DDR2 memory behavior and robust thermal range.

This device is well suited for design teams needing a proven DDR2 memory building block offering industrial operation, compact packaging, and a standard DDR2 feature set documented in the product datasheet.

For pricing, availability or to request a quote for MT47H64M8B6-3 IT:D TR, please submit a request or contact sales to obtain a formal quote and lead-time information.