MT47H64M8SH-187E:H TR
| Part Description |
IC DRAM 512MBIT PAR 60FBGA |
|---|---|
| Quantity | 1,077 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 60-FBGA (8x10) | Memory Format | DRAM | Technology | SDRAM - DDR2 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 350 ps | Grade | Commercial (Extended) | ||
| Clock Frequency | 533 MHz | Voltage | 1.7V ~ 1.9V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 85°C (TC) | Write Cycle Time Word Page | 15 ns | Packaging | 60-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of MT47H64M8SH-187E:H TR – IC DRAM 512MBIT PAR 60FBGA
The MT47H64M8SH-187E:H TR is a 512 Mbit volatile memory device implemented as DDR2 SDRAM with a parallel memory interface. It delivers a 64M × 8 organization with a 533 MHz clock frequency and is supplied in a 60‑TFBGA package.
This device is intended for designs that require a compact DDR2 DRAM solution with specified timing and electrical characteristics, including a 1.7 V to 1.9 V supply range and an operating temperature range of 0°C to 85°C.
Key Features
- Memory Architecture DDR2 SDRAM technology in a 64M × 8 organization providing 512 Mbit total capacity.
- Performance 533 MHz clock frequency with an access time of 350 ps and a write cycle time (word/page) of 15 ns for predictable timing behavior.
- Voltage and Power Operates from a 1.7 V to 1.9 V supply range as specified for DDR2 operation.
- Package Supplied in a 60‑TFBGA package; supplier device package listed as 60‑FBGA (8×10).
- Interface and Format Parallel DRAM interface suitable for systems designed to accept DDR2 parallel memory components.
- Operating Range Specified operating temperature range: 0°C to 85°C (TC).
- Memory Type Volatile DRAM memory format.
Typical Applications
- Systems requiring DDR2 DRAM Use as a 512 Mbit DDR2 memory component in designs that accept a parallel DDR2 interface and 60‑TFBGA package.
- Compact board-level memory Suitable where a 60‑FBGA (8×10) footprint and 512 Mbit density fit board layout constraints.
- Designs with defined timing needs Applies to applications that require the specified 533 MHz clocking, 350 ps access time, and 15 ns write cycle timing.
Unique Advantages
- 512 Mbit density: Provides a mid-range memory capacity in a single 64M × 8 DDR2 device to match system memory budgets.
- DDR2 performance at 533 MHz: Enables operation at a specified 533 MHz clock frequency with documented access and cycle timings.
- Compact BGA packaging: 60‑TFBGA / 60‑FBGA (8×10) footprint supports high‑density board designs where area is a consideration.
- Low-voltage operation: 1.7 V to 1.9 V supply range aligns with DDR2 power domains and helps constrain supply design.
- Specified thermal range: Rated for operation from 0°C to 85°C (TC), allowing deployment within that ambient range.
- Clear timing specifications: Access time and write cycle time values provide deterministic parameters for memory subsystem design.
Why Choose MT47H64M8SH-187E:H TR?
The MT47H64M8SH-187E:H TR from Micron Technology Inc. is a straightforward DDR2 SDRAM device offering 512 Mbit capacity in a 64M × 8 organization. Its defined electrical and timing specifications—533 MHz clocking, 350 ps access time, 15 ns write cycle, and a 1.7 V–1.9 V supply range—make it suitable for designs that require predictable DDR2 behavior in a compact 60‑TFBGA package.
Choose this part for projects that need a vendor‑supplied DDR2 memory component with clear capacity, timing, voltage, and temperature specifications for board‑level memory integration and system-level planning.
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