MT47H64M8SH-187E:H TR

IC DRAM 512MBIT PAR 60FBGA
Part Description

IC DRAM 512MBIT PAR 60FBGA

Quantity 1,077 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package60-FBGA (8x10)Memory FormatDRAMTechnologySDRAM - DDR2
Memory Size512 MbitAccess Time350 psGradeCommercial (Extended)
Clock Frequency533 MHzVoltage1.7V ~ 1.9VMemory TypeVolatile
Operating Temperature0°C ~ 85°C (TC)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of MT47H64M8SH-187E:H TR – IC DRAM 512MBIT PAR 60FBGA

The MT47H64M8SH-187E:H TR is a 512 Mbit volatile memory device implemented as DDR2 SDRAM with a parallel memory interface. It delivers a 64M × 8 organization with a 533 MHz clock frequency and is supplied in a 60‑TFBGA package.

This device is intended for designs that require a compact DDR2 DRAM solution with specified timing and electrical characteristics, including a 1.7 V to 1.9 V supply range and an operating temperature range of 0°C to 85°C.

Key Features

  • Memory Architecture  DDR2 SDRAM technology in a 64M × 8 organization providing 512 Mbit total capacity.
  • Performance  533 MHz clock frequency with an access time of 350 ps and a write cycle time (word/page) of 15 ns for predictable timing behavior.
  • Voltage and Power  Operates from a 1.7 V to 1.9 V supply range as specified for DDR2 operation.
  • Package  Supplied in a 60‑TFBGA package; supplier device package listed as 60‑FBGA (8×10).
  • Interface and Format  Parallel DRAM interface suitable for systems designed to accept DDR2 parallel memory components.
  • Operating Range  Specified operating temperature range: 0°C to 85°C (TC).
  • Memory Type  Volatile DRAM memory format.

Typical Applications

  • Systems requiring DDR2 DRAM  Use as a 512 Mbit DDR2 memory component in designs that accept a parallel DDR2 interface and 60‑TFBGA package.
  • Compact board-level memory  Suitable where a 60‑FBGA (8×10) footprint and 512 Mbit density fit board layout constraints.
  • Designs with defined timing needs  Applies to applications that require the specified 533 MHz clocking, 350 ps access time, and 15 ns write cycle timing.

Unique Advantages

  • 512 Mbit density: Provides a mid-range memory capacity in a single 64M × 8 DDR2 device to match system memory budgets.
  • DDR2 performance at 533 MHz: Enables operation at a specified 533 MHz clock frequency with documented access and cycle timings.
  • Compact BGA packaging: 60‑TFBGA / 60‑FBGA (8×10) footprint supports high‑density board designs where area is a consideration.
  • Low-voltage operation: 1.7 V to 1.9 V supply range aligns with DDR2 power domains and helps constrain supply design.
  • Specified thermal range: Rated for operation from 0°C to 85°C (TC), allowing deployment within that ambient range.
  • Clear timing specifications: Access time and write cycle time values provide deterministic parameters for memory subsystem design.

Why Choose MT47H64M8SH-187E:H TR?

The MT47H64M8SH-187E:H TR from Micron Technology Inc. is a straightforward DDR2 SDRAM device offering 512 Mbit capacity in a 64M × 8 organization. Its defined electrical and timing specifications—533 MHz clocking, 350 ps access time, 15 ns write cycle, and a 1.7 V–1.9 V supply range—make it suitable for designs that require predictable DDR2 behavior in a compact 60‑TFBGA package.

Choose this part for projects that need a vendor‑supplied DDR2 memory component with clear capacity, timing, voltage, and temperature specifications for board‑level memory integration and system-level planning.

Request a quote or contact sales to discuss availability and pricing for MT47H64M8SH-187E:H TR.

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