MT52L1G32D4PG-093 WT:B

The MT52L1G32D4PG-093 WT:B is a 32 Gbit volatile DRAM implemented as Mobile LPDDR3 SDRAM and organized as 1G × 32. It operates at a clock frequency of 1.067 GHz and a nominal supply voltage of 1.2 V, delivered in a compact 178-ball FBGA package.

This device is intended for designs that require high-density mobile LPDDR3 memory in a space-efficient package, with a specified operating temperature range of −30°C to 85°C (TC).

Key Features

• Memory Core  Mobile LPDDR3 SDRAM technology, organized as 1G × 32 for a total density of 32 Gbit.
• Performance  Clock frequency specified at 1.067 GHz to support high-speed DRAM operation within LPDDR3 timing domains.
• Power  Designed for a 1.2 V supply voltage, consistent with LPDDR3 low-voltage operation.
• Package  Supplied in a 178-ball VFBGA/FBGA package (178-FBGA, 12 × 11.5 mm footprint) for compact board-level integration.
• Memory Format & Mounting  Volatile DRAM format suitable for system memory implementations that require LPDDR3 characteristics.
• Operating Temperature  Specified operating temperature range of −30°C to 85°C (TC) for temperature-constrained embedded and mobile environments.

Typical Applications

• Mobile and handheld devices  Provides high-density LPDDR3 memory for applications where compact, low-voltage DRAM is required.
• Embedded systems  Used in space-constrained designs that need a 32 Gbit volatile memory solution with a small FBGA footprint.
• Memory subsystems  Integrates into memory stacks and modules that specify LPDDR3 operation at 1.067 GHz and 1.2 V supply.

Unique Advantages

• High density in a small footprint: 32 Gbit capacity in a 178-FBGA package enables compact board layouts without sacrificing memory size.
• LPDDR3 low-voltage operation: 1.2 V supply supports lower-power memory designs consistent with mobile LPDDR3 requirements.
• High-speed clock support: 1.067 GHz clock frequency supports fast DRAM access rates within LPDDR3 timing specifications.
• Wide operating temperature: Rated for −30°C to 85°C (TC), suitable for a range of commercial and industrial temperature environments.
• Standardized ball-grid package: 178-VFBGA/FBGA package (12 × 11.5 mm) simplifies board-level placement and assembly in compact systems.

Why Choose IC DRAM 32GBIT 1067MHZ 178FBGA?

The MT52L1G32D4PG-093 WT:B is positioned for designs that require a high-density LPDDR3 DRAM solution with defined performance and power characteristics: 32 Gbit density, 1.067 GHz operation, and 1.2 V supply in a compact 178-ball FBGA package. Its specified operating temperature range of −30°C to 85°C and standardized package format make it suitable for space- and power-constrained mobile and embedded systems.

Manufactured by Micron Technology Inc., this device provides a verifiable specification set for engineers specifying mobile LPDDR3 memory where density, low-voltage operation, and package size are primary selection criteria.

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