MT53B512M64D4NK-053 WT:C
| Part Description |
IC DRAM 32GBIT 1.866GHZ 366WFBGA |
|---|---|
| Quantity | 686 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 366-WFBGA (15x15) | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 1.866 GHz | Voltage | 1.1V | Memory Type | Volatile | ||
| Operating Temperature | -30°C ~ 85°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 366-WFBGA | ||
| Mounting Method | Volatile | Memory Interface | N/A | Memory Organization | 512M x 64 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0036 |
Overview of MT53B512M64D4NK-053 WT:C – IC DRAM 32GBIT 1.866GHZ 366WFBGA
The MT53B512M64D4NK-053 WT:C is a volatile SDRAM device based on Mobile LPDDR4 technology, offering 32 Gbit of DRAM capacity organized as 512M × 64. It operates at a clock frequency of 1.866 GHz and is supplied at 1.1 V.
Designed for compact, high-density memory implementations, this device is presented in a 366-ball WFBGA package (15 × 15 mm) and supports an operating temperature range of -30°C to 85°C (TC).
Key Features
- Memory Core and Architecture Mobile LPDDR4 SDRAM technology with a total capacity of 32 Gbit organized as 512M × 64.
- High-Speed Operation Rated clock frequency of 1.866 GHz to support high-bandwidth memory operations.
- Low-Voltage Supply Single-supply operation at 1.1 V to support low-power system designs.
- Package 366-ball WFBGA package with a 15 × 15 mm footprint for compact board-level integration.
- Temperature Range Specified operating temperature from -30°C to 85°C (TC) for a range of thermal environments.
- Memory Type Volatile DRAM format suitable for system memory applications requiring temporary data storage.
Typical Applications
- Mobile and Portable Devices Mobile LPDDR4 technology and a low 1.1 V supply make this device suitable for compact mobile memory subsystems.
- High-Density Memory Modules 32 Gbit capacity in a 15 × 15 mm WFBGA package enables high-density memory integration on space-constrained PCBs.
- Embedded Systems High clock frequency and dense organization support embedded designs that require substantial volatile memory bandwidth.
Unique Advantages
- High Capacity in a Small Footprint: 32 Gbit organized as 512M × 64 in a 15 × 15 mm 366-WFBGA package reduces board area for large-memory designs.
- High Bandwidth Operation: 1.866 GHz clocking supports higher data throughput where fast volatile memory is required.
- Low Supply Voltage: 1.1 V operation helps lower overall power consumption in battery‑sensitive applications.
- Wide Operating Temperature: Rated from -30°C to 85°C (TC) for use across varied thermal environments.
- Standard DRAM Format: Volatile SDRAM implementation suitable for system memory roles in LPDDR4-based designs.
Why Choose MT53B512M64D4NK-053 WT:C?
The MT53B512M64D4NK-053 WT:C balances high density, high-speed operation, and low-voltage operation in a compact 366-WFBGA package. Its Mobile LPDDR4 architecture and 1.866 GHz clock rate provide a clear specification for designs that require substantial volatile memory bandwidth in a small footprint.
This device is well suited to designers building mobile, portable, or embedded systems that need 32 Gbit of DRAM capacity at 1.1 V and an operating temperature range from -30°C to 85°C. The combination of capacity, speed, and package geometry supports integration choices where board space and power are key considerations.
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