MT53B512M64D4NK-053 WT:C

IC DRAM 32GBIT 1.866GHZ 366WFBGA
Part Description

IC DRAM 32GBIT 1.866GHZ 366WFBGA

Quantity 686 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package366-WFBGA (15x15)Memory FormatDRAMTechnologySDRAM - Mobile LPDDR4
Memory Size32 GbitAccess TimeN/AGradeIndustrial
Clock Frequency1.866 GHzVoltage1.1VMemory TypeVolatile
Operating Temperature-30°C ~ 85°C (TC)Write Cycle Time Word PageN/APackaging366-WFBGA
Mounting MethodVolatileMemory InterfaceN/AMemory Organization512M x 64
Moisture Sensitivity Level1 (Unlimited)RoHS ComplianceUnknownREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0036

Overview of MT53B512M64D4NK-053 WT:C – IC DRAM 32GBIT 1.866GHZ 366WFBGA

The MT53B512M64D4NK-053 WT:C is a volatile SDRAM device based on Mobile LPDDR4 technology, offering 32 Gbit of DRAM capacity organized as 512M × 64. It operates at a clock frequency of 1.866 GHz and is supplied at 1.1 V.

Designed for compact, high-density memory implementations, this device is presented in a 366-ball WFBGA package (15 × 15 mm) and supports an operating temperature range of -30°C to 85°C (TC).

Key Features

  • Memory Core and Architecture Mobile LPDDR4 SDRAM technology with a total capacity of 32 Gbit organized as 512M × 64.
  • High-Speed Operation Rated clock frequency of 1.866 GHz to support high-bandwidth memory operations.
  • Low-Voltage Supply Single-supply operation at 1.1 V to support low-power system designs.
  • Package 366-ball WFBGA package with a 15 × 15 mm footprint for compact board-level integration.
  • Temperature Range Specified operating temperature from -30°C to 85°C (TC) for a range of thermal environments.
  • Memory Type Volatile DRAM format suitable for system memory applications requiring temporary data storage.

Typical Applications

  • Mobile and Portable Devices Mobile LPDDR4 technology and a low 1.1 V supply make this device suitable for compact mobile memory subsystems.
  • High-Density Memory Modules 32 Gbit capacity in a 15 × 15 mm WFBGA package enables high-density memory integration on space-constrained PCBs.
  • Embedded Systems High clock frequency and dense organization support embedded designs that require substantial volatile memory bandwidth.

Unique Advantages

  • High Capacity in a Small Footprint: 32 Gbit organized as 512M × 64 in a 15 × 15 mm 366-WFBGA package reduces board area for large-memory designs.
  • High Bandwidth Operation: 1.866 GHz clocking supports higher data throughput where fast volatile memory is required.
  • Low Supply Voltage: 1.1 V operation helps lower overall power consumption in battery‑sensitive applications.
  • Wide Operating Temperature: Rated from -30°C to 85°C (TC) for use across varied thermal environments.
  • Standard DRAM Format: Volatile SDRAM implementation suitable for system memory roles in LPDDR4-based designs.

Why Choose MT53B512M64D4NK-053 WT:C?

The MT53B512M64D4NK-053 WT:C balances high density, high-speed operation, and low-voltage operation in a compact 366-WFBGA package. Its Mobile LPDDR4 architecture and 1.866 GHz clock rate provide a clear specification for designs that require substantial volatile memory bandwidth in a small footprint.

This device is well suited to designers building mobile, portable, or embedded systems that need 32 Gbit of DRAM capacity at 1.1 V and an operating temperature range from -30°C to 85°C. The combination of capacity, speed, and package geometry supports integration choices where board space and power are key considerations.

Request a quote or contact sales to discuss availability, lead times, and pricing for the MT53B512M64D4NK-053 WT:C.

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