MT53B512M64D4TX-053 WT:C
| Part Description |
IC DRAM 32GBIT 1.866GHZ FBGA |
|---|---|
| Quantity | 380 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 1.866 GHz | Voltage | 1.1V | Memory Type | Volatile | ||
| Operating Temperature | -30°C ~ 85°C (TC) | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | Volatile | Memory Interface | N/A | Memory Organization | 512M x 64 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0036 |
Overview of MT53B512M64D4TX-053 WT:C – IC DRAM 32GBIT 1.866GHZ FBGA
The MT53B512M64D4TX-053 WT:C is a 32 Gbit volatile DRAM device based on Mobile LPDDR4 SDRAM technology. It delivers a 512M × 64 memory organization with a 1.866 GHz clock frequency and operates from a 1.1 V supply.
This device is intended for systems that require high-density mobile LPDDR4 memory with defined operating temperature capability, providing a balance of capacity, frequency, and low-voltage operation.
Key Features
- Memory Architecture Mobile LPDDR4 SDRAM architecture designed for volatile memory applications.
- Density & Organization 32 Gbit total capacity organized as 512M × 64 bits to support wide data paths and substantial on-board memory.
- Operating Frequency 1.866 GHz clock frequency for high-rate memory transactions within the device’s specified frequency.
- Voltage Supply Low-voltage operation at 1.1 V to support power-sensitive designs.
- Temperature Range Rated for operation from −30 °C to 85 °C (TC), enabling use across a range of environmental conditions.
- Package Supplied in FBGA form factor as indicated by the product designation.
Typical Applications
- Mobile Devices Used in mobile LPDDR4 memory subsystems where high-density, low-voltage DRAM is required.
- Handheld Electronics Suitable for handheld platforms that need compact, high-capacity volatile memory at mobile DRAM speeds.
- Embedded Systems Applicable for embedded designs that integrate LPDDR4 memory for temporary data storage and processing buffers.
Unique Advantages
- High Capacity: 32 Gbit density supports greater memory footprint for data buffering and application memory.
- Wide Data Organization: 512M × 64 organization provides a broad data bus for efficient data transfer.
- High Clock Rate: 1.866 GHz operating frequency enables higher transaction rates within LPDDR4 constraints.
- Low Supply Voltage: 1.1 V operation reduces overall power draw in low-power system designs.
- Extended Temperature Range: −30 °C to 85 °C rating accommodates deployments in varied thermal environments.
- Mobile LPDDR4 Technology: Designed specifically for LPDDR4-based memory solutions in portable and embedded applications.
Why Choose IC DRAM 32GBIT 1.866GHZ FBGA?
The MT53B512M64D4TX-053 WT:C positions itself as a high-density LPDDR4 memory component that combines 32 Gbit capacity, a 512M × 64 organization, and a 1.866 GHz clock frequency with low-voltage 1.1 V operation. These characteristics make it suitable for designs that require substantial volatile memory bandwidth and reduced power consumption.
Backed by Micron Technology Inc., this device is appropriate for engineers specifying LPDDR4 mobile DRAM in compact FBGA implementations and for projects that demand predictable temperature performance and defined electrical parameters.
Request a quote or contact sales to discuss availability, pricing, and suitability for your design.