MT53B512M64D8HR-053 WT ES:B TR

IC DRAM 32GBIT 1.866GHZ FBGA
Part Description

IC DRAM 32GBIT 1.866GHZ FBGA

Quantity 681 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatDRAMTechnologySDRAM - Mobile LPDDR4
Memory Size32 GbitAccess TimeN/AGradeIndustrial
Clock Frequency1.866 GHzVoltage1.1VMemory TypeVolatile
Operating Temperature-30°C ~ 85°C (TC)Write Cycle Time Word PageN/APackagingN/A
Mounting MethodVolatileMemory InterfaceN/AMemory Organization512M x 64
Moisture Sensitivity Level1 (Unlimited)RoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.0036

Overview of MT53B512M64D8HR-053 WT ES:B TR – IC DRAM 32GBIT 1.866GHZ FBGA

The MT53B512M64D8HR-053 WT ES:B TR is a 32 Gbit DRAM device based on Mobile LPDDR4 SDRAM technology. It implements a 512M × 64 memory organization and is presented in an FBGA package as indicated in the product name.

This device is specified for operation at a clock frequency of 1.866 GHz with a 1.1V supply and an operating temperature range of -30°C to 85°C (TC), making it suitable where those electrical and environmental parameters are required.

Key Features

  • Core / Memory Architecture Mobile LPDDR4 SDRAM technology with a memory organization of 512M × 64, providing a 32 Gbit capacity.
  • Clock / Performance Rated clock frequency: 1.866 GHz.
  • Power Voltage supply: 1.1V.
  • Package FBGA package indicated in the product name.
  • Memory Type Volatile DRAM format.
  • Operating Temperature Specified range: -30°C to 85°C (TC).

Unique Advantages

  • High memory density: 32 Gbit capacity with a 512M × 64 organization for designs that require large onboard DRAM.
  • Specified high-speed operation: Rated for 1.866 GHz clock frequency to meet defined high-rate timing requirements.
  • Low-voltage operation: Operates at a 1.1V supply to align with low-voltage system designs.
  • Temperature tolerance: Operating range of -30°C to 85°C (TC) for deployments requiring that thermal window.
  • Mobile LPDDR4 technology: Implements Mobile LPDDR4 SDRAM architecture as specified in the product data.

Why Choose MT53B512M64D8HR-053 WT ES:B TR?

This device is positioned as a high-density Mobile LPDDR4 DRAM component specified for 1.866 GHz operation at a 1.1V supply and an operating temperature range of -30°C to 85°C (TC). Its 512M × 64 organization and 32 Gbit capacity make it suitable for designs that require those explicit electrical and environmental specifications.

Choose this part when a documented Mobile LPDDR4 memory solution with the stated clock frequency, voltage supply, and temperature range is required; it provides a clear, specification-driven option for integration into systems matching these parameters.

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