MT53D1024M32D4BD-053 WT:D TR
| Part Description |
IC DRAM 32GBIT 1.866GHZ FBGA |
|---|---|
| Quantity | 214 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 1.866 GHz | Voltage | 1.1V | Memory Type | Volatile | ||
| Operating Temperature | -30°C ~ 85°C (TC) | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | Volatile | Memory Interface | N/A | Memory Organization | 1G x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0036 |
Overview of MT53D1024M32D4BD-053 WT:D TR – IC DRAM 32GBIT 1.866GHZ FBGA
The MT53D1024M32D4BD-053 WT:D TR is a 32 Gbit volatile DRAM device implemented in Mobile LPDDR4 SDRAM technology. It is organized as 1G × 32 and operates at a clock frequency of 1.866 GHz, targeting designs that require high-density mobile-class memory.
With 1.1 V supply operation and an operating temperature range of −30°C to 85°C, this Micron Technology Inc. memory component suits applications where low-voltage LPDDR4 memory and defined commercial temperature performance are required.
Key Features
- Memory Technology Mobile LPDDR4 SDRAM (volatile DRAM) offering LPDDR4 architecture for mobile-class memory implementations.
- Capacity & Organization 32 Gbit capacity organized as 1G × 32, providing a high-density footprint for memory subsystems.
- Clock Frequency Operates at 1.866 GHz clock frequency to support higher data-rate operation within its specified technology class.
- Supply Voltage 1.1 V nominal voltage supply compatible with low-voltage mobile memory system designs.
- Temperature Range Specified operating temperature from −30°C to 85°C (TC), suitable for defined commercial and industrial ambient conditions.
- Package & Format Listed as FBGA in the product name and provided in a DRAM memory format suitable for board-level integration.
Typical Applications
- Mobile devices — LPDDR4 memory for mobile-class designs where low-voltage, high-density memory is required.
- Embedded systems — High-density DRAM for embedded platforms that leverage LPDDR4 architecture and 1.1 V operation.
- Memory subsystems — Integration into memory modules or subsystems requiring 32 Gbit devices organized as 1G × 32.
Unique Advantages
- High memory density: 32 Gbit capacity supports space-constrained designs that require substantial DRAM storage.
- Mobile LPDDR4 architecture: Built on LPDDR4 SDRAM technology, aligning with mobile-class memory design requirements.
- High clock rate: 1.866 GHz operation enables higher data-rate performance within the specified technology.
- Low-voltage operation: 1.1 V supply reduces power budget for systems designed around low-voltage DRAM.
- Wide operating temperature: −30°C to 85°C specification provides defined thermal range for many commercial and industrial deployments.
Why Choose IC DRAM 32GBIT 1.866GHZ FBGA?
The MT53D1024M32D4BD-053 WT:D TR delivers a combination of high capacity, LPDDR4 architecture, and low-voltage 1.1 V operation from Micron Technology Inc. It is positioned for designs that require a mobile-class DRAM device with a 1G × 32 organization and a 1.866 GHz clock frequency.
This device is suited to engineers and procurement teams specifying high-density LPDDR4 memory for mobile and embedded platforms, or for use in memory subsystems where capacity, defined operating temperature, and low-voltage operation are key selection criteria.
Request a quote or submit an inquiry to obtain pricing and availability for the MT53D1024M32D4BD-053 WT:D TR.
