MT53D1024M32D4DT-053 AIT:D
| Part Description |
IC DRAM 32GBIT 1.866GHZ 200VFBGA |
|---|---|
| Quantity | 1,176 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 200-VFBGA (10x14.5) | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 1.866 GHz | Voltage | 1.1V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 95°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 200-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | N/A | Memory Organization | 1G x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q100 | ECCN | EAR99 | HTS Code | 8542.32.0036 |
Overview of MT53D1024M32D4DT-053 AIT:D – IC DRAM 32 Gbit 1.866 GHz 200-VFBGA
The MT53D1024M32D4DT-053 AIT:D is a volatile DRAM device implemented in Mobile LPDDR4 SDRAM architecture. It provides a 32 Gbit memory organized as 1G × 32 with a 1.866 GHz clock frequency and a 1.1 V supply requirement.
Qualified to AEC-Q100 and specified over an operating temperature range of −40°C to 95°C (TC), this device targets designs requiring high-density LPDDR4 memory in automotive-grade and temperature-sensitive applications. The device is offered in a 200-VFBGA (10 × 14.5 mm) package for compact board integration.
Key Features
- Memory Core Volatile DRAM implemented as Mobile LPDDR4 SDRAM with a memory size of 32 Gbit organized as 1G × 32.
- Clock and Performance Rated clock frequency of 1.866 GHz for high-rate data transfer in LPDDR4 memory systems.
- Power Low-voltage operation with a specified supply voltage of 1.1 V.
- Package 200-VFBGA package; supplier device package specified as 200-VFBGA (10 × 14.5 mm) for compact footprint and surface mounting.
- Temperature and Qualification Operating temperature range −40°C to 95°C (TC) and AEC-Q100 qualification; device grade listed as Automotive.
- Mounting Type MountingType: Volatile.
Typical Applications
- Automotive systems — AEC-Q100 qualification and −40°C to 95°C operating range enable use in automotive electronic modules that require LPDDR4 memory density.
- Mobile LPDDR4 designs — The Mobile LPDDR4 architecture and 1.866 GHz clock frequency support high-rate memory requirements in compact system designs.
- Temperature-sensitive embedded equipment — Specified operating temperature range and automotive grade make the device suitable for embedded systems operating across extended temperatures.
Unique Advantages
- High-density memory: 32 Gbit capacity (1G × 32) provides substantial on-board DRAM density for memory-intensive applications.
- High data-rate timing: 1.866 GHz clock frequency supports high-rate LPDDR4 data transfers where throughput is required.
- Low-voltage operation: 1.1 V supply reduces power draw relative to higher-voltage memory options.
- Automotive qualification: AEC-Q100 qualification combined with an Automotive grade designation supports designs requiring qualified components.
- Compact BGA footprint: 200-VFBGA (10 × 14.5 mm) package enables dense PCB layouts and surface-mount assembly.
Why Choose MT53D1024M32D4DT-053 AIT:D?
The MT53D1024M32D4DT-053 AIT:D combines Mobile LPDDR4 architecture, 32 Gbit density, and a 1.866 GHz operating clock to deliver a balanced solution for designs that demand high-density, high-rate volatile memory. Its 1.1 V supply and 200-VFBGA package support compact, power-conscious implementations.
With AEC-Q100 qualification and an extended operating temperature range of −40°C to 95°C, the device is positioned for customers developing automotive-grade and temperature-challenged embedded systems that require verified component qualification and stable operating characteristics. The product is manufactured by Micron Technology Inc.
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