MT53D1024M32D4NQ-062 WT ES:D

IC DRAM 32GBIT 1.6GHZ 200VFBGA
Part Description

IC DRAM 32GBIT 1.6GHZ 200VFBGA

Quantity 279 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package200-VFBGA (10x14.5)Memory FormatDRAMTechnologySDRAM - Mobile LPDDR4
Memory Size32 GbitAccess TimeN/AGradeIndustrial
Clock Frequency1.6 GHzVoltage1.1VMemory TypeVolatile
Operating Temperature-30°C ~ 85°C (TC)Write Cycle Time Word PageN/APackaging200-VFBGA
Mounting MethodVolatileMemory InterfaceN/AMemory Organization1G x 32
Moisture Sensitivity Level1 (Unlimited)RoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNOBSOLETEHTS CodeN/A

Overview of MT53D1024M32D4NQ-062 WT ES:D – IC DRAM 32GBIT 1.6GHZ 200VFBGA

The MT53D1024M32D4NQ-062 WT ES:D is a 32 Gbit volatile DRAM device implemented as mobile LPDDR4 SDRAM. It is organized as 1G × 32 and operates at a clock frequency of 1.6 GHz with a 1.1 V supply.

Targeted for space-constrained, high-density memory implementations, this device combines high clock speed, low operating voltage and a compact 200‑VFBGA (10×14.5) package for integration into mobile and portable designs requiring LPDDR4 memory.

Key Features

  • Memory Type Volatile DRAM implemented as SDRAM – Mobile LPDDR4, provided in a 32 Gbit density.
  • Organization & Capacity Arranged as 1G × 32 to deliver a total memory size of 32 Gbit for high-capacity footprints.
  • Clock Performance Rated for operation at 1.6 GHz to meet timing requirements for LPDDR4 applications.
  • Power Low-voltage operation at 1.1 V to support power-sensitive system designs.
  • Package Supplied in a 200‑VFBGA package (10×14.5 mm) for compact board-level integration.
  • Temperature Range Operating temperature: −30 °C to 85 °C (TC), suitable for a range of commercial and industrial thermal environments.

Typical Applications

  • Mobile devices and handhelds — Provides LPDDR4 memory capacity and frequency suitable for compact mobile platforms that require low-voltage operation.
  • Embedded processing platforms — Serves as main or auxiliary DRAM for embedded systems that need 32 Gbit density in a small package.
  • Portable multimedia equipment — Supports memory-intensive tasks at 1.6 GHz clocking while maintaining a 1.1 V supply to conserve power.

Unique Advantages

  • High-density memory — 32 Gbit capacity enables higher memory integration without increasing board count.
  • LPDDR4 technology — Mobile LPDDR4 SDRAM architecture aligns with designs targeting low-power, high-performance memory needs.
  • Compact VFBGA package — 200‑VFBGA (10×14.5) footprint simplifies placement in space-constrained assemblies.
  • Low operating voltage — 1.1 V supply reduces system power consumption compared to higher-voltage alternatives.
  • Wide operating temperature — −30 °C to 85 °C operation supports deployment across varied thermal conditions.
  • Measured clock rate — 1.6 GHz operation provides a defined performance envelope for time-sensitive memory tasks.

Why Choose MT53D1024M32D4NQ-062 WT ES:D?

The MT53D1024M32D4NQ-062 WT ES:D positions itself as a high-density LPDDR4 DRAM option that balances capacity, clock rate and low-voltage operation in a compact 200‑VFBGA package. Its specification set is appropriate for designs that require a defined 1.6 GHz operating point, 32 Gbit memory capacity and a 1.1 V power domain.

This device is suitable for engineers and procurement teams specifying memory for mobile and embedded platforms where board area, power budget and thermal range are key constraints. Its combination of capacity, package and electrical characteristics supports scalable integration into space- and power-sensitive systems.

Request a quote or contact sales to obtain pricing, availability and additional ordering information for the MT53D1024M32D4NQ-062 WT ES:D.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up